Production process of copper aluminum composite decorative material

A decorative material, copper-aluminum composite technology, applied in manufacturing tools, rolling mill control devices, metal processing equipment, etc. Low strength and other problems, to achieve the effect of improving interface bonding and electrical conductivity, beautiful appearance, and low contact resistance

Active Publication Date: 2020-02-04
江苏中色复合材料有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The first object of the present invention is to provide a production method of a copper-aluminum composite decoration material, so as to solve the problem that the preparation method of the existing copper-aluminum composite decoration material is complex in process, high in production cost, and difficult to prepare a wide-width high-strength copper-aluminum composite material. question
[0005] The second object of the present invention is to provide a copper-aluminum composite decoration material to solve the problem of low peeling strength between the copper layer and the aluminum layer of the existing copper-aluminum composite decoration material, low tensile strength of the copper-aluminum composite decoration material, and elongation. low rate problem

Method used

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  • Production process of copper aluminum composite decorative material

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Effect test

Embodiment 1

[0023] The production method of the copper-aluminum composite decorative material of the present embodiment comprises the following steps:

[0024] (1) One side surface of the T2 copper plate with a width of 1200mm and a thickness of 1.0mm is electroplated with tin to obtain a copper plate blank with a tin-plated layer, and the thickness of the tin-plated layer is 0.003mm; Tin sulfamate, 0.8% sulfuric acid, 0.9% AlCl 3 and 6% trisodium phosphate, the solvent is water; the temperature of electroplating tin is 200°C, the voltage is 380V, the current is 600A, and the current density is 0.5A / dm 2 ;

[0025] (2) Facing the aluminum plate with the tin-plated layer of the copper plate blank with the tin-plated layer, it is hot-rolled and compounded with 1060 aluminum plates with a thickness of 8 mm, annealed and heat-treated, and cold-rolled to obtain a copper-aluminum composite decorative material; the temperature of the hot-rolled compound is 300° C. The rolling speed of hot-roll...

Embodiment 2

[0027] The production method of the copper-aluminum composite decorative material of the present embodiment comprises the following steps:

[0028] (1) One side surface of the T2 copper plate with a width of 1500mm and a thickness of 1.2mm is electroplated with tin to obtain a copper plate blank with a tin-plated layer, and the thickness of the tin-plated layer is 0.010mm; Tin sulfamate, 2% sulfuric acid, 1.1% AlCl 3 and 6.5% trisodium phosphate, the solvent is water; the temperature of tin plating is 280°C, the voltage is 380V, the current is 800A, and the current density is 3.0A / dm 2 ;

[0029] (2) Facing the aluminum plate with the tin-plated layer of the copper plate blank with the tin-plated layer, hot-rolling and compounding with 8mm thick 3004 aluminum plate, annealing heat treatment, cold-rolling, to obtain the copper-aluminum composite decorative material; the temperature of hot-rolling and compounding is 350 DEG C, The rolling speed of hot-rolling cladding is 6m / mi...

Embodiment 3

[0031] The production method of the copper-aluminum composite decorative material of the present embodiment comprises the following steps:

[0032] (1) The both sides surfaces of T2 copper plate of 1800mm wide 1.0mm thickness are electroplated tin, obtain the copper plate blank with two-layer tin-plated layer, the thickness of each layer of tin-plated layer is 0.020mm; Fraction 3% tin sulfamate, 3% sulfuric acid, 2% AlCl 3 and 4% trisodium phosphate, the solvent is water; the temperature of electroplating tin is 320°C, the voltage is 380V, the current is 700A, and the current density is 4.5A / dm 2 ;

[0033] (2) With the tin-plated layer of the copper plate blank with the tin-plated layer facing the aluminum plate, hot rolling and compounding with two 8mm thick 4343 aluminum plates, annealing heat treatment, cold rolling, obtain copper-aluminum composite decorative material; the temperature of hot-rolling compounding is 350 ℃, the rolling speed of hot rolling composite is 6m / ...

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Abstract

The invention discloses a production process of a copper aluminum composite decorative material, and belongs to the technical field of new materials. The production process of the copper aluminum composite decorative material comprises the following steps that firstly, one side surface or two side surfaces of a copper plate are tined, and a copper plate workblank with a tinning layer is obtained;and secondly, the tinning layer of the copper plate workblank with the tinning layer faces an aluminum plate, and the tinning layer and the aluminum plate are subjected to hot rolling compositing, heat treatment and cold rolling, so that the copper aluminum composite decorative material is obtained. The production process is simplified, energy saving and environment friendliness are achieved, production cost is reduced, the process is suitable for compositing of copper plates of any marks and 1-series, 2-series, 3-series, 4-series, 5-series, 6-series, 7-series or 8-series aluminum plates, thecomposite rate reaches 100%, the peeling strength is larger than or equal to 12N / mm, the copper composite layer thickness ratio in the copper aluminum composite decorative material is smaller than orequal to 15%, the tensile strength reaches 110 to 300 MPa, the ductility is larger than or equal to 25%, and the process is suitable for preparing the wide high-strength copper aluminum composite decorative material.

Description

technical field [0001] The application relates to the technical field of new materials, in particular to a production process of a copper-aluminum composite decorative material. Background technique [0002] Copper-aluminum composite board is a multi-metal board formed by compounding copper on the aluminum base with aluminum as the base. It can combine the advantages of high electrical conductivity and low cost of aluminum with the high chemical stability and low cost of copper. The characteristics of contact resistance are combined to form a copper-aluminum composite board. Copper-aluminum composite boards replace copper boards and copper-coated aluminum boards are widely used in high-tech fields such as 4G network communications, aerospace, aviation, PC, IC, LED heat dissipation, high and low voltage power transmission and distribution, and architectural decoration industries. It is the development direction of new metal materials and research hotspots. [0003] At prese...

Claims

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Application Information

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IPC IPC(8): B21B1/38B21B37/74B21B37/00C22F1/04C22F1/08
CPCB21B1/38B21B37/74B21B37/00C22F1/04C22F1/08B21B2001/386B21B2001/383B21B2201/06
Inventor 尚郑平周庆元熊桑
Owner 江苏中色复合材料有限公司
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