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Copper-clad laminate

A copper-clad layer and laminated board technology, which is applied in the field of copper-clad laminated boards, can solve problems such as the deterioration of dry film resist adhesion, and achieve a smooth surface

Active Publication Date: 2020-01-31
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the surface of the copper-plated film has too many irregularities, the adhesion of the dry film resist will be deteriorated.

Method used

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  • Copper-clad laminate
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  • Copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Follow the steps below to prepare the substrate. As a base film, a polyimide film (manufactured by Ube Industries, Ltd., Upilex-35SGAV1) having a thickness of 35 μm was prepared. Place the base film in a magnetron sputtering device. A nickel-chromium alloy target and a copper target are set in a magnetron sputtering device. The composition of the nickel-chromium alloy target was 20% by mass of Cr and 80% by mass of Ni. In a vacuum environment, a base metal layer made of nickel-chromium alloy with a thickness of 25 nm was formed on one surface of the base film, and a copper thin film layer with a thickness of 100 nm was formed thereon.

[0061] Next, a copper plating solution was prepared. The copper plating solution contains 120g / L copper sulfate, 70g / L sulfuric acid, 20mg / L leveler component, 1100mg / L polymer component, 16mg / L brightener component, and 50mg / L chlorine component. As a leveler component, a diallyldimethylammonium chloride-sulfur dioxide copolymer (ma...

Embodiment 2

[0065] A copper-clad laminate was obtained in the same manner as in Example 1. However, in the electrolytic plating, the current density was changed so as to include seven jump periods. Other conditions are the same as in Example 1.

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Abstract

The present invention provides a copper-clad laminate capable of smoothing the surface of a copper-plated film after chemical polishing. The copper-clad laminate (1) is provided with a base film (11),a metal layer (12) formed on the surface of the base film (11), and a copper-plated coating film (20) that is formed on the surface of the metal layer (12) and contains chlorine as an impurity. The average particle diameter of the crystal grains of the copper-plated film (20) is 300 nm or less. Preferably, the copper plating film (20) has a structure in which high-chlorine-concentration layers (21) having a high chlorine concentration and low-chlorine-concentration layers (22) having a low chlorine concentration are alternately laminated.

Description

technical field [0001] The invention relates to a copper-clad laminate. More specifically, this invention relates to the copper clad laminated board used for manufacture of a flexible printed wiring board (FPC) etc. Background technique [0002] A flexible printed wiring board in which a wiring pattern is formed on the surface of a resin film is used in liquid crystal panels, notebook computers, digital cameras, mobile phones, and the like. The flexible printed wiring board is manufactured, for example, from a copper-clad laminate. [0003] As a method of manufacturing a copper-clad laminate, a metal spraying method is known. Manufacture of the copper-clad laminated board by the metallization method is performed in the following procedure, for example. First, a base metal layer composed of nickel-chromium alloy is formed on the surface of the resin film. Next, a copper thin film layer is formed on the base metal layer. Next, a copper plating film is formed on the copper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09
CPCH05K1/09C25D3/38C23C28/02C23C14/205C23C14/025C23C14/352H05K2201/0154H05K2201/05C25D5/10C23C14/35
Inventor 渡边智治小川茂树下地匠西山芳英
Owner SUMITOMO METAL MINING CO LTD
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