A kind of preparation technology of flexible transparent conductive film

Abstract

The invention provides a preparation process of a flexible transparent conductive film, which relates to the technical field of electronic devices; the invention first cuts through the colloidal layer on the colloidal layer according to the grid shapes of triangles, rectangles and hexagons through laser cutting colloidal film technology After the mesoscale cracks are obtained, the colloidal solution on the substrate dries up to produce microscale cracks. On the colloid layer that has produced microscale and mesoscale cracks, the metal is deposited on the microscale and mesoscale by magnetron sputtering technology. In the crack, and remove the colloid on the substrate, and finally obtain the conductive film of the substrate and the composite metal mesh covered on the substrate; the prepared conductive film has excellent conductivity, and can realize its resistance value after repeated bending Almost unchanged, its production process is non-toxic and harmless, low in cost, easy to operate, and can be mass-produced. The flexible transparent conductive film produced can replace the traditional ITO conductive film and is used in light-emitting electronic devices, touch screen panels, etc. field of electronic devices.

Description

technical field [0001] The invention relates to the field of electronic device manufacturing, in particular to a preparation process of a flexible transparent conductive film. Background technique [0002] Transparent conductive electrodes with excellent mechanical flexibility will become an important component of next-generation wearable optoelectronic devices, occupying an increasingly important position in the fields of light-emitting devices, photovoltaic cells, touch screen panels, etc. Tin-doped indium oxide (ITO) has become the most widely used transparent conductive film material in academia and industry due to its optical transparency, thermal and chemical stability, device compatibility, and well-developed fabrication process. [0003] Although the preparation of ITO plastic films has been achieved, its application in various wearable optoelectronic devices is still limited due to the brittle nature of ITO. In addition, the high cost of indium element also makes t...

AI Technical Summary

Problems solved by technology

The existence of a large number of bonding points between metal nanowires makes the resistance of the conductive film larger, which limits its further application in the field of flexible electronics

At present, most metal nanogrids are prepared by photolithography technology and coating technology. The photolithography technology is complex and costly, which is not conducive to large-area roll-to-roll production.

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