Flexible transparent conductive film and preparation technology thereof

A technology of transparent conductive film and preparation process, which is applied in the direction of equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, conductive layers on insulating carriers, etc., and can solve the limitations of the application in the field of flexible electronics and the complexity of photolithography technology , high resistance of the conductive film, etc.

Pending Publication Date: 2019-12-20
厦门派恩杰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existence of a large number of bonding points between metal nanowires makes the resistance of the conductive film larger, which limits its further application in the field of flexible electronics
At present, most metal nanogrids are prepared by photolithography technology and coating technology. The photolithography technology is complex and costly, which is not conducive to large-area roll-to-roll production.

Method used

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  • Flexible transparent conductive film and preparation technology thereof
  • Flexible transparent conductive film and preparation technology thereof
  • Flexible transparent conductive film and preparation technology thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0059] The first embodiment of the present invention provides a preparation process of a flexible transparent conductive film, and the specific steps of the preparation process include:

[0060] (1) Cut a polyethylene terephthalate (PET) film (light transmittance ~ 95%) with a thickness of 100 μm into a rectangular piece of 50cm*60cm, wash it with deionized water and absolute ethanol for 30min, respectively, Dry and use as a base. Prepare TiO with a concentration of 5% 2 weak. TiO with a thickness of 1 μm was sprayed 2 The colloidal layer is evenly coated on the surface of the PET substrate;

[0061] (2) Place the colloidal film in step (1) at an air pressure of 1*10 -3 Pa, the humidity is 40%, and the temperature is 55°C and dried to make it evenly cracked;

[0062] (3) Then the grid is processed on the colloidal template by laser cutting colloidal film technology, and the shape of the grid is controlled by the computer as a triangular grid such as Figure 4 As shown in...

Embodiment 2

[0066] The steps of the second embodiment are roughly the same as those of the first embodiment. The difference is that in this embodiment, in step (3), the grid is processed on the colloidal template by laser cutting colloidal film technology, and the grid shape is a rectangular network. grid, such as Figure 4 (b) shown.

[0067] Embodiment 2 of the present invention provides the same implementation principles and technical effects as Embodiment 1. For brief description, for details not mentioned in this embodiment, reference may be made to the corresponding content in Embodiment 1.

Embodiment 3

[0069] The steps of the third embodiment are roughly the same as those of the first embodiment. One of the differences is that in this embodiment, in step (3), the grid is processed on the colloidal template by laser cutting colloidal film technology, and the grid shape is A hexagonal grid such as Figure 4 As shown in (c), the second difference is that in step (5), the film is immersed in absolute ethanol to remove the colloid, and dried to obtain a flexible transparent conductive film.

[0070] Embodiment 3 of the present invention provides the same implementation principles and technical effects as Embodiment 1. For brief description, for details not mentioned in this embodiment, reference may be made to the corresponding content in Embodiment 1.

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Abstract

The invention provides a flexible transparent conductive film and a preparation technology thereof and relates to the technical field of electronic devices. The flexible transparent conductive film provided by the invention comprises a substrate and a composite metal mesh covering the substrate, wherein the composite metal mesh is a composite structure of a first metal mesh and a second metal mesh. According to the preparation technology, a colloid mask with a hierarchical structure is prepared through carrying out blade coating of colloid layers on different flexible substrates, drying up thecolloid layers to generate cracks and accompanying with a colloid template laser cutting technology, and then the flexible transparent conductive film with the hierarchical structure is prepared by using a magnetron sputtering technology and an ultrasonic treatment method, so that the prepared flexible transparent conductive film has the advantages of being innocuous, harmless, low in cost and simple in operation, can be prepared on a large scale, can replace a traditional ITO conductive film and is applied to the field of wearable optoelectronic devices, such as a light-emitting electronic device, a photovoltaic cell and a touch screen panel.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a flexible transparent conductive film and a preparation process thereof. Background technique [0002] Transparent conductive electrodes with excellent mechanical flexibility will become an important component of next-generation wearable optoelectronic devices, occupying an increasingly important position in the fields of light-emitting devices, photovoltaic cells, touch screen panels, etc. Tin-doped indium oxide (ITO) has become the most widely used transparent conductive film material in academia and industry due to its optical transparency, thermal and chemical stability, device compatibility, and well-developed fabrication process. [0003] Although the preparation of ITO plastic films has been achieved, its application in various wearable optoelectronic devices is still limited due to the brittle nature of ITO. In addition, the high cost of indium element also makes this ...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B5/12H01B13/00
CPCH01B5/14H01B5/12H01B13/0026
Inventor 苏秋聪王金贵许清池郭季丰
Owner 厦门派恩杰科技有限公司
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