A kind of preparation method of LCP flexible substrate passive resistance-capacitance element

Abstract

The invention proposes a preparation method of a passive resistance-capacitance element of an LCP flexible substrate, electroplating a Ni / Pd / Au layer on the copper-clad surface of a clean LCP substrate, sputtering a thin-film resistance layer and a conduction band layer on the copper-clad surface, and performing electroplating , photolithography, wet etching to prepare the resistance and conduction band, and then use the lift-off process to make a capacitor layer on the LCP substrate, and finally sputter the thin film conduction band layer on the surface, and perform electroplating, photolithography, wet method Etching, making the upper electrode and conduction band of the capacitor, and completing the preparation of the passive resistance-capacitance element of the LCP flexible substrate. The manufacturing method utilizes thin-film sputtering technology, which can simultaneously produce thin-film resistors and thin-film capacitors on the LCP substrate at one time, and can also fabricate thin-film resistor-capacitance networks to realize thin-film integration and high-precision control of resistor-capacitor components. The embedding of passive resistance-capacitance components in the device LCP system-in-package can greatly save the surface space of the LCP flexible substrate and increase the assembly density of the substrate.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and particularly relates to a preparation method of a passive resistance-capacitance element of an LCP flexible substrate. Background technique [0002] With the rapid development of lightweight, multi-functional, miniaturized, and low-cost electronic systems, and the continuous increase in operating frequency, the research on electronic systems especially applied in the fields of radio frequency and microwave has become the focus of the electronic system industry. Lightweight, low-cost, high-frequency packaging substrate materials put forward higher requirements. At the same time, due to the development requirements of electronic system integration, the demand for on-board passive components is increasing, which has become a key factor restricting the miniaturization of electronic equipment. At present, in electronic systems, the number of passive components is 20-100 times the number o...

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The patent does not involve the specific manufacturing process, nor does it involve the capacitor manufacturing process

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