A kind of preparation method of LCP flexible substrate passive resistance-capacitance element
A technology of resistance-capacitance components and flexible substrates, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, capacitors, etc., can solve problems that do not involve the manufacturing process of capacitors, and achieve the effects of saving surface space, increasing assembly density, and improving bonding force
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[0037] In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0038] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar promotions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific implementation disclosed below.
[0039] figure 1 A preparation method of a passive resistance-capacitance element of an LCP flexible substrate according to an embodiment of the present invention is shown, including the following steps:
[0040] (a1) Provide an LCP substrate with single-sided copper...
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