High-density three-dimensional stacking and assembling method for electronic modules
A three-dimensional stacking, electronic module technology, applied in the computer field, to improve the integration density and solve the effect of heat dissipation
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[0032] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0033] A high-density three-dimensional stacking and assembling method for electronic modules, which consists of multiple functional circuit boards, functional circuit sub-cards, front motherboards, rear motherboards and other circuit components, as well as the rear cover of the chassis, the front cover of the chassis, the left cover of the chassis, The structural components such as the right cover plate of the chassis, the upper frame of the chassis, and the lower frame of the chassis are stacked through multi-dimensional and multi-level methods, such as figure 1 shown.
[0034] The specific stacking and assembly steps are as follows: figure 2 Shown:
[0035] 1] Through the inter-board parallel connector, perform parallel stacking of functional circuit boards, functional circuit sub-cards and heat dissipation plates to complete functional circuit components, such...
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