A microled mass transfer device and method based on selective heating and demagnetization

Abstract

The invention belongs to the field of mass transfer technology, and specifically discloses a MicroLED mass transfer device and method based on selective heating and demagnetization, which includes a substrate and a magnetic square array arranged on the upper surface of the substrate, and each of the magnetic square arrays The magnetic squares are all magnetic and have different magnetic poles on the upper and lower surfaces, and each magnetic square can lose its magnetism under the action of external heating. During the transfer operation, the magnetic square array is in one-to-one correspondence with the magnetic MicroLED array to be transferred. Using the magnetic square array Pick up the MicroLED array as a whole, and then selectively heat the magnetic block to demagnetize it to selectively transfer the MicroLED to a magnetic target circuit substrate. The invention can realize patterning and selective mass transfer of Micro LEDs, and has the advantages of convenient operation, strong applicability, precise positioning, and the like.

Description

technical field [0001] The invention belongs to the technical field of mass transfer, and more specifically relates to a Micro LED mass transfer device and method based on selective heating and demagnetization. Background technique [0002] Micro LED (μLED) is a new generation of display technology, which has higher brightness, higher luminous efficiency, longer life and lower power consumption than the existing organic light emitting diode (OLED). Micro light-emitting diodes have the characteristics of self-illumination and no need for a backlight source, and each pixel can be addressed and turned on individually. [0003] The manufacturing process of micro-light-emitting diode displays is usually to thin, miniaturize, and array the diode (LED) structure so that its size is only about 10 microns, and then transfer a large number (tens of thousands to tens of millions) of micro-light-emitting diode chips Form an LED array on the display circuit substrate, and finally packag...

AI Technical Summary

Problems solved by technology

At present, the selective transfer technologies are as follows: 1) Variable pitch transfer by film stretching and patterning laser, which is achieved by temporarily bonding chips on the polymer transparent film stretching layer, and then stretching the transparent film Realize the adjustment of the chip spacing, and finally release the chip with a patterned laser. This method has problems such as uneven stretching time, and the cost of the patterned laser is high; 2) Selective transfer is achieved by transfer stamps. Transfer stamps with microstructures are patterned, selectively pick up chips, and then release the chips on the circuit substrate. This method is more troublesome to make stamps, and there are problems such as inaccurate positioning.

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