Room temperature NO2 sensor based on in-situ growth nano In2O3 on surface of non-metal mineral electrode substrate and preparation method
A non-metallic mineral and substrate surface technology, applied in nanotechnology for materials and surface science, nanotechnology for sensing, nanotechnology, etc., can solve the problems of complex preparation methods, slow recovery speed, and singleness , to achieve the effects of simple synthesis process, increased density and reduced production cost
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Embodiment 1
[0030] Based on non-metallic mineral material porous ceramic electrode substrate, its structure schematic diagram is as follows figure 1 shown. The electrodes on the surface of the substrate are formed by sputtering Ni and Au thin films successively on the porous ceramic substrate covered with interdigitated electrode mask by direct current sputtering method, the thickness of the Ni thin film is 10nm, and the thickness of the Au thin film is 50nm, the interdigital width is 0.5mm, and the interdigital spacing is 0.5mm.
[0031] The specific sputtering steps are first sputtering a layer of Ni film, the sputtering current is 17mA, and the sputtering time is 120s; then sputtering a layer of Au film, the sputtering current is 10mA, and the sputtering time is 230s; Sputtering environmental conditions are: argon gas flow rate 200sccm, vacuum degree 90mTorr, sputtering using plasma sputtering apparatus (Hefei Kejing Material Technology Co., Ltd., VTC-16-3HD).
[0032] The material o...
Embodiment 2
[0044] Based on non-metallic mineral material porous ceramic electrode substrate, its structure schematic diagram is as follows figure 1 shown. The electrodes on the surface of the substrate are formed by sputtering Ni and Au thin films successively on the porous ceramic substrate covered with interdigitated electrode mask by direct current sputtering method, the thickness of the Ni thin film is 10nm, and the thickness of the Au thin film 50nm, interdigital width 0.5mm, interdigital spacing 0.5mm.
[0045] The specific sputtering steps are first sputtering a layer of Ni film, the sputtering current is 17mA, and the sputtering time is 120s; then sputtering a layer of Au film, the sputtering current is 10mA, and the sputtering time is 230s; The ambient conditions for sputtering are as follows: argon gas flow rate is 200 sccm, vacuum degree is 90 mTorr, and a plasma sputtering apparatus (Hefei Kejing Material Technology Co., Ltd., VTC-16-3HD) is used for sputtering.
[0046]The...
Embodiment 3
[0057] Based on non-metallic mineral material porous ceramic electrode substrate, its structure schematic diagram is as follows figure 1 shown. The electrodes on the surface of the substrate are formed by sputtering Ni and Au thin films successively on the porous ceramic substrate covered with interdigitated electrode mask by direct current sputtering method, the thickness of the Ni thin film is 10nm, and the thickness of the Au thin film 50nm, interdigital width 0.5mm, interdigital spacing 0.5mm.
[0058] The specific sputtering steps are first sputtering a layer of Ni film, the sputtering current is 17mA, and the sputtering time is 120s; then sputtering a layer of Au film, the sputtering current is 10mA, and the sputtering time is 230s; The ambient conditions for sputtering are: argon flow rate of 200 sccm, vacuum degree of 90 mTorr, and sputtering using a plasma sputtering apparatus (Hefei Kejing Material Technology Co., Ltd., VTC-16-3HD).
[0059] The material of the por...
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