High-heat-conductivity anisotropic polymer-based composite material and preparation method thereof

Abstract

The invention provides a high-heat-conductivity anisotropic polymer-based composite material and a preparation method thereof. The composite material is of an overlapped structure consisting of multiple composite fiber layers after overlapping and hot-pressing, wherein the composite fiber layers are formed by covering surfaces of polymer nanofibers by heat conduction fillers. In preparation, a heat conduction packing dispersion solution is sucked into an injector for high-pressure electrostatic spraying, and is adhered to the polymer nanofibers under the actions of electrostatic force and hydrogen bonds, then a network structure with fillers which contact with one another and are arranged in an orientation direction is formed, and after overlapping, the composite material is prepared through cold-pressing compression and hot-pressing molding. Due to the special structure of the composite material, efficient conduction paths are formed by the fillers in the composite material filled with the fillers, the purpose that the heat conductivity of the polymer-based composite material is remarkably improved by a small amount of the high heat conduction fillers can be achieved, and heat conduction requirements in preparing electronic and electric equipment can be met.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting composite material preparation, and relates to a high-heat-conducting anisotropic polymer-based composite material and a preparation method thereof. Background technique [0002] With the miniaturization, high integration and multi-functionalization of modern electronic and electrical equipment, a large amount of heat has accumulated in the equipment, which may cause thermal failure or even explosion of these electronic and electrical equipment. Therefore, effective thermal management of these electrical and electronic devices is crucial for their performance, reliability and lifetime. In addition, in many cutting-edge technology fields, especially next-generation flexible electronic devices or cutting-edge aerospace technologies, there are additional stricter performance requirements for thermal management materials, such as electrical insulation, ultra-high in-plane lateral thermal condu...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problems of low thermal conductivity increase efficiency and high thermal resistance between fillers of existing filled thermal conductive composite materials with the increase of filler content, and provide a kind of super-high in-plane thermal conductivity, low thermal resistance contact between fillers, and isotropic Anisotropic polymer-based composite material with high thermal conductivity and its preparation method characterized by heterogeneous structure and easy preparation

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