PCB circuit manufacturing method and PCB

Abstract

The invention discloses a PCB circuit manufacturing method and a PCB. The method comprises the following steps: using a thin copper foil with the diameter of 10 to 13 microns as the outermost layer ofcopper foil of a type setting PCB, then laminating, reducing the copper on the outer layer to be 7 to 9 microns after laminating, then carrying out hole drilling and low-speed chemical adhesive cleaning, using vertically continuous electroplating manufacturing in later electroplating working procedure, controlling the thickness of copper on the inner wall of the hole to be 15 to 20 microns and the thickness of copper on the surface to be 24 to 30 microns, then carrying out surface roughening in a cinerite spraying mode for turning off a polishing brush, then using a laser direct imaging exposure machine for exposure in the manufacturing process of an outer circuit, carrying out developing and etching by using a low-pressure and high-speed mode, and presetting 10% to 20% of a circuit compensating value in advance. The problems, such as a great number of too thin and too wide lines, excessive etching, under developing, short circuits and open circuits existing in the circuit manufacturing process, of the PCB product with fine circuits (for example, the ratio of line width to line gap is smaller than or equal to 2 mil/2 mill) can be solved.

Description

technical field [0001] The invention relates to the field of electronic manufacturing, in particular to a PCB circuit manufacturing method and a PCB. Background technique [0002] Fine circuit PCB (Printed Circuit Board, printed circuit board) generally refers to PCB products with outer layer line width / line gap ≤ 2mil / 2mil. The key process of its production is generally used as follows: pressing→drilling→electroplating→ Outer line graphics transfer. [0003] Due to the precision characteristics of fine lines, the requirements for the production process are higher. In the above-mentioned general production process, normalized process parameters are used for production, and the control points of the thickness control of the laminated copper foil, the process and method of electroplating, and the transfer of the outer layer pattern , it is difficult to meet the requirements of fine circuit PCB production. If the general production process and method are used, it is easy to c...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a PCB circuit manufacturing method and PCB, which can solve a large number of fine line (such as line width/line gap ≤ 2mil/2mil)

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