Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film

A technology of benzimidazole polyamic acid and polyimide film is applied in the field of benzimidazole-substituted polyimide film and preparation, and can solve the problems affecting the performance and yield of flexible circuit boards, and the water absorption of polyimide. High rate, secondary processing influence and other problems, to achieve the effect of good dimensional stability, excellent mechanical properties, high thermal stability

Active Publication Date: 2019-09-06
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polyimide prepared by the above-mentioned prior art has a high water absorption rate (WA>6%), and it is easy to cause quality defects such as cracking and delamination of the flexible circuit board in the production process of the flexible circuit board when used in the flexible circuit board, which is serious. Affect the performance and yield of flexible circuit boards
At the same time, Qingming Xia published "Synthesis and Characterization of High-Performance Polyimides Based on 6,4'-Diamino-2-Phenylbenzimidazole" in "Journal of applied polymerscience" in 2017, stating that benzimidazole polyimides are not soluble in Common polar solvents, such as dimethyl sulfoxide (DMSO), DMF, DMAc, NMP, tetrahydrofuran (THF), m-cresol, etc., affect the secondary processing of materials and limit the use of materials

Method used

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  • Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film
  • Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film
  • Benzimidazole-substituted polyimide, preparation method thereof, benzimidazole-substituted polyimide film, and preparation method and application of film

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preparation example Construction

[0058] The present invention provides the preparation method of the benzimidazole substituted polyimide described in above-mentioned technical scheme, comprises the following steps:

[0059] Under protective atmosphere conditions, diamine monomers, dianhydride monomers and solvents are mixed for polymerization to obtain benzimidazole polyamic acid;

[0060] Carrying out imidization reaction of the benzimidazole polyamic acid to obtain a benzimidazole-substituted polyimide;

[0061] The diamine monomer has a structure shown in formula A-1 or formula A-2:

[0062]

[0063] In formula A-1 and formula A-2, R 1 Any of the following substituents are included:

[0064]

[0065] The dianhydride monomer includes any one or both of the following structural formulas:

[0066]

[0067] In the present invention, unless otherwise specified, all raw material components are commercially available products well known to those skilled in the art.

[0068] The invention mixes diamin...

Embodiment 1

[0101]

[0102] Under nitrogen protection conditions, add 10g of 6-amino-2-(4-aminobenzene)-1-methylbenzimidazole to 50g of N,N-dimethylacetamide, stir and mix under ice bath conditions, add 9.1601 g pyromellitic dianhydride continued to stir, and the viscosity of the system increased with the prolongation of the stirring time, and 58.6 g of N,N-dimethylacetamide was added, and the solid content of the resulting system was 15.0 wt%. Start the timing, after the polymerization reaction for 10 hours, remove the reaction device and seal the bottle mouth, and put it in a refrigerator at -20°C for 24 hours to freeze and defoam to obtain a uniform yellow benzimidazole polyamic acid glue (PAA glue) ;

[0103] Thaw the PAA glue solution at room temperature for 30 minutes, apply a film on a clean and flat glass sheet with a thickness of 400 μm, transfer the coated glass sheet to a blast oven, and set the temperature at 80°C / 1h+140°C / 1h+200°C / 1h temperature rise program to remove th...

Embodiment 2

[0105]

[0106] Under nitrogen protection conditions, 10g of 6-amino-2-(4-aminobenzene)-1-methylbenzimidazole was added to 50g of N,N-dimethylacetamide, stirred and mixed under ice bath conditions, and 12.3471 g3,3',4,4'-biphenyltetracarboxylic dianhydride continued to stir, and the viscosity of the system increased with the prolongation of the stirring time, and 76.6g of N,N-dimethylacetamide was added, and the solid The content is 15.0wt%, and the timing starts from the completion of adding the solvent. After 10 hours of polymerization reaction, remove the reaction device and seal the bottle mouth, and put it in a refrigerator at -20°C for 24 hours to freeze and defoam, and obtain uniform yellow benzimidazole Polyamic acid glue (PAA glue);

[0107] Thaw the PAA glue solution at room temperature for 30 minutes, apply a film on a clean and flat glass sheet with a thickness of 400 μm, transfer the coated glass sheet to a blast oven, and set the temperature at 80°C / 1h+140°C / 1...

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Abstract

The invention provides a benzimidazole-substituted polyimide, a preparation method thereof, a benzimidazole-substituted polyimide film, and a preparation method and an application of the film, and belongs to the technical field of polyimide materials. The glass transition temperature of the benzimidazole-substituted polyimide film is 328-431 DEG C, the 5% thermal decomposition temperature is 498-537 DEG C, the tensile strength is 69-190 MPa, the tensile modulus is 3.5-6.2 GPa, the water absorption rate is 1.12-1.78%, the thermal expansion coefficient is 2.5-48.0 ppm / K, and the film is thermally soluble in m-cresol, N-methylpyrrolidone, dimethyl sulfoxide, N,N-dimethylformamide, N,N-dimethylacetamide and tetrahydrofuran organic solvents. The benzimidazole-substituted polyimide film providedby the invention has the advantages of high thermal stability, good dimensional stability, low water absorption rate, excellent mechanical properties, and good solubility in organic solvents.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a benzimidazole-substituted polyimide and a preparation method thereof, a benzimidazole-substituted polyimide film, a preparation method and an application thereof. Background technique [0002] Polyimide (Polyimide, referred to as PI), refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain, and is one of the organic polymer materials with the best comprehensive performance. Excellent mechanical properties, electrical properties and flexibility, widely used in electronics, electrical engineering, aerospace and other industries, among them, polyimide films used in flexible circuit boards and other fields need to have excellent heat and cold resistance, radiation resistance , insulation and dimensional stability. [0003] Polyimide is generally prepared by polymerization of diamine monomers and dianhydride monomers. Among them, polyimide fil...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1039C08G73/1085C08J5/18C08J2379/08
Inventor 李慧钱广涛陈春海姚佳楠刘刚陈海权胡梦杰于有海
Owner DONGHUA UNIV
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