3D printing integrated radiator and application thereof in phased-array antenna

Abstract

The invention relates to the field of heat dissipation, in particular to a micro-channel radiator, integrated manufacturing and an application of the micro-channel radiator in a control array antenna.The radiator is manufactured through 3D printing. Through a fluid channel which is distributed in a gradually changed manner and a liquid injection port and a liquid outlet which are respectively formed at the biggest end and the smallest end of the flow channel, cooling liquid uniformly passes through the whole fluid channel. When the radiator is in use, the highest temperature of the radiator is 298K, the lowest temperature of the radiator is 295K, and the temperature difference after heat dissipation is 3 DEG C. Compared with a pure runner structure, the radiator is stronger in heat dissipation capability and more uniform in temperature distribution after heat dissipation, and has the characteristics of good heat dissipation performance and temperature uniformity, one-time forming, noneed of using a nut sealing ring and the like for packaging.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a radiator, a method for manufacturing the radiator and a heat dissipation device for a microchannel of a controlled array antenna. Background technique [0002] With the development of electronic systems towards miniaturization and integration, integrated multi-functional electronic systems and devices have emerged. With the improvement of the integration of various original devices, the packaging density is getting smaller and smaller, and the heat flux density of the electronic system has increased sharply. Electronic systems with small size, light weight and efficient heat dissipation are required, and the motherboards and cooling systems of existing electronic equipment are required. The traditional air cooling technology can no longer meet the heat dissipation requirements of high heat flux devices. The efficient liquid cooling technology can not only meet the electrical sig...

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Problems solved by technology

This patent uses the raised part to form a water channel for water cooling and heat exchange, but it does not consider that the flow rate of the heat exchange fluid at the inlet is large, and the pressure drop increases, which reduces the flow rate of the heat exchange fluid in the subsequent process, and the heat exchange fluid with reduced flow rate It cannot fully contact with the inside of the heat exchange container, resulting in a large "heat exchange dead volume" inside the heat exchange container. At the same time, the temperature of the heat exchange fluid rises in the second half of the fluid stroke. In the case of "thermal dead volume", the heat exchange of the whole heat exchange device is extremely uneven, without any heat exchange uniformity effect

[0008] CN200820115950.9 discloses an aluminum pass-through water-cooling heat sink. The water-cooling heat sink is processed with continuously bent waterways inside and is provided with corresponding water inlets and water outlets. As in the above reference document, only water cooling is considered. Heat transfer, without considering the uniform temperature performance of heat transfer

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