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Preparation method of high-performance conductive nano ceramic metal clad coating on pure copper surface

A technology of ceramic metal and conductive nano, which is applied in the coating process and coating of metal materials, which can solve the problems of increased coating pores and enhanced phase agglomeration, and achieve the effects of reducing pores, avoiding agglomeration, and good electrical conductivity

Active Publication Date: 2019-08-06
ZHONGBEI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the content of the reinforcing phase is further increased, defects such as increased pores in the coating and agglomeration of the reinforcing phase will also occur.

Method used

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  • Preparation method of high-performance conductive nano ceramic metal clad coating on pure copper surface
  • Preparation method of high-performance conductive nano ceramic metal clad coating on pure copper surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Take a piece of 20mm×20mm×15mm industrial pure copper, and use its 20mm×20mm surface as the experimental surface. First, polish the surface of the pure copper substrate with 150# sandpaper to remove the oxide layer and other impurities on the surface of the substrate. Then place it in absolute ethanol and acetone and ultrasonically clean it for 5 minutes to clean off the oil stains remaining on the surface of the substrate. Finally, air-dry and paint with ink for blackening treatment.

[0025] Add 2000ml of 0.1mol / L ZrOCl into the beaker 2 Solution, under magnetic stirring, 1000ml of 0.2mol / LNaBH 4 The solution is dripped into a beaker, reacted to obtain a white sol, filtered out the sol, and washed 3 times with absolute ethanol to obtain Zr(OH) 4 gel.

[0026] Weigh 31.3g Zr(OH) 4 Gel, 80g Cu powder, 12.4g B 2 o 3 The powder and 10.6 g of graphite were uniformly mixed to obtain a coating material. The coating material is evenly coated on the surface of the pure ...

Embodiment 2

[0039] According to the method of Example 1, the surface of the 20mm × 20mm × 15mm pure copper substrate is pretreated, and Zr(OH) 4 gel.

[0040] Weigh 28.1g Zr(OH) 4 Gel, 82g Cu powder, 11.1g B 2 o 3 Powder and 9.5g of graphite were mixed evenly to obtain a coating material. The coating material is evenly coated on the surface of the pure copper substrate with a coating thickness of 3 mm to form a layer to be clad.

[0041] Set the laser power of the semiconductor laser to 2800W, the spot diameter to 4mm, the flow rate of argon gas to 15L / min, and the overlap rate to 50%. Aim the laser head of the semiconductor laser at the layer to be clad, and follow the set track at a rate of 2mm / s. The scanning speed continuously scans the layer to be clad, and forms ZrB on the surface of the pure copper substrate 2 1.5mm thick nano-ZrB with 18wt% content 2 / Cu ceramic metal cladding coating.

[0042] The hardness, electrical conductivity and tensile strength of the cladding coati...

Embodiment 3

[0047] According to the method of Example 1, the surface of the 20mm × 20mm × 15mm pure copper substrate is pretreated, and Zr(OH) 4 gel.

[0048] Weigh 25g Zr(OH) 4 Gel, 84g Cu powder, 9.9g B 2 o 3 The powder and 8.5g of graphite are mixed and evenly coated on the surface of the pure copper substrate with a coating thickness of 3mm to form a layer to be clad.

[0049] Set the laser power of the semiconductor laser to 2800W, the spot diameter to 4mm, the flow rate of argon gas to 15L / min, and the overlap rate to 50%. Aim the laser head of the semiconductor laser at the layer to be clad, and follow the set track at a rate of 3mm / s. The scanning speed continuously scans the layer to be clad, and forms ZrB on the surface of the pure copper substrate 2 1.5mm thick nano-ZrB with 16wt% content 2 / Cu ceramic metal cladding coating.

[0050] The hardness, electrical conductivity and tensile strength of the cladding coating were detected according to the test method of Example 1....

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Abstract

The invention discloses a preparation method of a high-performance conductive nano ceramic metal clad coating on a pure copper surface. The invention relates to a method for preparing Zr(OH) 4 gel byusing a collosol-gel method, 19-24 wt% of Zr (OH) gel, 59-66 wt% of Cu powder, 7-10 wt% of B2O3 powder and 6-8 wt% of graphite are mixed and coat the surface of a pure copper matrix, and laser scanning and cladding is carried out to obtain a nano ZrB2 / Cu ceramic metal cladding coating is achieved. According to the preparation method, the cladding coating is formed by laser irradiation on the basisof in-situ reaction, so that the good compactness of the cladding coating and the uniform distribution of the ZrB2 in the coating are realized, and the nano-ceramic metal cladding coating with high hardness, high tensile strength and good conductivity is obtained.

Description

technical field [0001] The invention belongs to the technical field of surface strengthening of pure copper materials, and relates to a method for coating a ceramic-metal composite coating on the surface of pure copper, in particular to a sol-gel method combined with laser cladding technology. A method for preparing a high-performance conductive cladding coating on a copper surface. Background technique [0002] Copper and copper alloys have many excellent properties, such as high thermal conductivity and electrical conductivity, excellent plasticity and toughness, etc., making them widely used as raw materials for aerospace and electrical contact components. However, the hardness, strength and wear resistance of copper and copper alloys are very low, so it is difficult to be directly applied under extreme environmental conditions. For example, iron-making blast furnace tuyeres, continuous casting crystallizers, electrical contact friction devices, and converter oxygen lanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C26/02
CPCC23C26/02
Inventor 李玉新聂金浩白培康苏科强赵占勇李忠华刘斌王建宏白婷田琦
Owner ZHONGBEI UNIV
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