Anisotropic electrically-conductive adhesive agent

A conductive adhesive, anisotropic technology, applied in the direction of conductive adhesive, conductive connection, adhesive, etc., can solve the problems of poor electrical connection, difficulty in miniaturization, flexibility, and low versatility of the substrate, and achieve excellent durability Effects of heat and light resistance

Pending Publication Date: 2019-07-09
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, wire bonding may lead to breakage and poor electrical connection.
In addition, the substrates for wire bonding have low versatility, making it difficult to miniaturize and flexibly

Method used

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  • Anisotropic electrically-conductive adhesive agent
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  • Anisotropic electrically-conductive adhesive agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0053] Hereinafter, examples of the present invention will be described. In this example, various anisotropic conductive adhesives were produced. Then, the blue LED chip was mounted on the substrate using an anisotropic conductive adhesive, and the LED mounting sample A was produced, and the push-out strength was measured at the initial stage and after the high-temperature, high-humidity continuous lighting test, and the heat resistance was evaluated. In addition, UV LED chips were mounted on the substrate using an anisotropic conductive adhesive, LED mounting sample B was produced, and the forward direction was measured at the initial stage, after the TCT (Temperature Cycling Test) test, and after the high-temperature, high-humidity continuous lighting test. Voltage, heat resistance and light resistance were evaluated. However, the present invention is not limited to these examples.

[0054] [Production of LED mounting samples]

[0055] figure 2 It is a figure for demons...

Embodiment 2

[0065] As shown in Table 1, weigh and add 100 mass parts of water glass (sodium silicate No. 3 shown in JIS K1408) and 10 mass parts of resin core conductive particles (average particle diameter 5 μm, nickel-plated, resin core particles (Nippon Chemical Co., Ltd. EH cores)) were stirred with a planetary mixer at 2000rpm / 2min to produce an anisotropic conductive adhesive. Other than that, LED mounting samples A and B were produced similarly to Example 1.

Embodiment 3

[0067] As shown in Table 1, 100 parts by mass of water glass (sodium silicate No. 3 listed in JIS K1408), 30 parts by mass of solder particles (particle size 10 μm to 25 μm, melting point 180°C, manufactured by Senju Metal Industry Co., Ltd.) and 5 parts by mass of resin core conductive particles (average particle diameter 5 μm, nickel-plated, resin core particles (EH core manufactured by Nippon Chemical Co., Ltd.)) were stirred at 2000 rpm / 2min with a planetary mixer to prepare an anisotropic conductive adhesive. Other than that, LED mounting samples A and B were produced similarly to Example 1.

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Abstract

Provided is an anisotropic electrically-conductive adhesive agent that has excellent heat resistance and light energy resistance. An anisotropic electrically-conductive adhesive agent for connecting alight-emitting element on an electrode of a wiring pattern of a substrate, wherein the anisotropic electrically-conductive adhesive agent contains an inorganic binder and electrically conductive particles. Because the adhesive component is an inorganic material, it is possible to obtain excellent heat resistance and light energy resistance. Particularly, even when an ultraviolet LED that emits ultraviolet rays of light energy having an intensity 2-3 times that of a blue LED is mounted, it is possible to obtain excellent heat resistance and light energy resistance.

Description

technical field [0001] The invention relates to an anisotropic conductive adhesive for mounting LEDs (Light Emitting Diodes, light emitting diodes). This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2016-231826 filed in Japan on November 29, 2016, and this application is incorporated by reference into this application. Background technique [0002] Conventionally, wire bonding is known as a method of mounting LED chip components on a circuit board. However, in wire bonding bonding, a wire may be broken and a poor electrical connection may occur. In addition, substrates for wire bonding have low versatility, making it difficult to reduce size and flexibility. [0003] As methods for solving the problems of wire bonding, Patent Documents 1 and 2 propose flip-chiping LEDs using an anisotropic conductive film in which conductive particles are dispersed in an epoxy-based adhesive and formed into a film. The method of inst...

Claims

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Application Information

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IPC IPC(8): H01L33/62C09J1/00C09J9/02C09J11/04H01B1/22H01B5/14H01B5/16H01B13/00H01R11/01H05K3/32
CPCH01R11/01C09J1/00C09J9/02C09J11/04H01L33/62H05K3/32H01B1/22H01B5/14H01B5/16H01B13/00
Inventor 青木正治
Owner DEXERIALS CORP
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