Memristive device based on transition metal carbide and preparation method thereof
A transition metal, memristive device technology, applied in electrical components and other directions, can solve problems such as poor synaptic plasticity effect, and achieve the effects of low cost, good conductivity and stability, and broad application prospects.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0038] The present invention also provides a method for preparing the above-mentioned memristive device, comprising the following steps:
[0039] S1) Bottom electrode deposition: In a vacuum environment, the substrate is fixed on the target gun of the sputtering system, the bottom electrode material is selected as the sputtering source, and the bottom electrode is deposited by a magnetron sputtering device. The bottom electrode is evenly and completely covered on the substrate. bottom surface;
[0040] S2) Dielectric layer sputtering: maintain the vacuum environment in step S1, replace the dielectric layer sputtering source, and uniformly and completely sputter the dielectric layer on the upper surface of the bottom electrode;
[0041] S3) Preparation of transition metal carbide suspension: mix transition metal carbide and deionized water at a mass ratio of 1:150, stir for 5min-15min, and prepare transition metal carbide suspension;
[0042] S4) Preparation of the resistive l...
Embodiment 1
[0046]A memristive device with a structure of copper / transition metal carbide / silicon dioxide / tungsten, the preparation method of which comprises the following steps:
[0047] S1) In a vacuum environment, fix the silicon substrate on the target gun of the sputtering system, select tungsten as the sputtering source, and deposit a tungsten electrode with a thickness of 90 nm by magnetron sputtering. The tungsten electrode is evenly and completely covered on the silicon the upper surface of the substrate;
[0048] S2) Maintaining the vacuum environment in step S1, replacing the silicon dioxide sputtering source, uniformly and completely sputtering a silicon dioxide dielectric layer with a thickness of 80 nm on the upper surface of the tungsten electrode;
[0049] S3) Take the transition metal carbide and deionized water and mix according to the mass ratio of 1:100, and stir for 10 minutes to prepare the transition metal carbide suspension;
[0050] S4) Absorb the upper turbid li...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com