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A kind of low-temperature lead-free solder and its gravity casting method

A gravity casting, lead-free solder alloy technology, applied in the high-reliability lead-free solder alloy and its gravity casting preparation, high-strength field, can solve the problems of increasing equipment cost, increasing process difficulty, etc., to meet the requirements of thinning and improving mechanics The effect of high performance and yield strength

Active Publication Date: 2021-03-12
云南锡业集团(控股)有限责任公司研发中心 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The methods adopted in the above two patents can reduce the oxidation of the alloy during the smelting process and improve the performance of the solder, but both the use of inert gas protection and vacuum smelting will increase the cost of equipment and increase the difficulty of the process

Method used

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  • A kind of low-temperature lead-free solder and its gravity casting method
  • A kind of low-temperature lead-free solder and its gravity casting method
  • A kind of low-temperature lead-free solder and its gravity casting method

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Example 1: This high-strength, high-reliability low-temperature lead-free solder alloy is made of the following components by mass percentage: Zn9%, Bi 7%, In5%, Ag 0.8%, Cu 0.3%, Ni 0.3%, Al 0.3 %, Ga 0.3%, Ge 0.3%, the refining agent of 0.2% of the total weight of metal raw materials (calcium carbonate is 50%, sodium chloride is 30%, potassium chloride is 20%), and the balance is Sn and unavoidable impurities ;

[0028] The preparation method of the above-mentioned low-temperature lead-free solder alloy is (1) industrially pure tin (Sn: 99.95wt%), industrially pure bismuth (Bi: 99.95wt%) and industrially pure zinc (Zn: 99.9wt%), and indium, Silver, copper, nickel, aluminum, germanium, and gallium were polished with 320-grit sandpaper to remove the oxide layer, and placed in a blast drying oven (40°C) for drying and preheating; (2) Alloy casting was performed using a stainless steel crucible, Before use, the surfaces of crucibles, slag removal tools, bell jars, etc. a...

Embodiment 2

[0031] Embodiment 2: This high-strength, high-reliability low-temperature lead-free solder alloy is made of the following components by mass percentage: Zn7%, Bi 4.5%, In 2%, Ag 0.1%, Cu 0.05%, Ni 0.01%, metal 0.1% refining agent (60% calcium carbonate, 20% sodium chloride, 20% potassium chloride) of the total weight of raw materials, the balance being Sn and unavoidable impurities;

[0032]The preparation method of the above-mentioned low-temperature lead-free solder alloy is (1) industrially pure tin (Sn: 99.95wt%), industrially pure bismuth (Bi: 99.95wt%) and industrially pure zinc (Zn: 99.9wt%), and indium, Silver, copper, and nickel metals were polished with 320-grit sandpaper to remove the oxide layer, and placed in a blast drying oven (40°C) for drying and preheating; (2) Stainless steel crucibles were used for alloy casting. Clean the surface of tools, bell jars, etc. to remove impurities, and then bake in an oven at 40°C to remove moisture before use. The temperature ...

Embodiment 3

[0035] Example 3: This high-strength, high-reliability low-temperature lead-free solder alloy is made of the following components by mass percentage: Zn11%, Bi 10%, In8%, Ag 1.5%, Cu 0.5%, Ni 0.5%, Al 0.5% %, Ga0.5%, Ge 0.5%, 0.5% of the total weight of metal raw materials as a refining agent (calcium carbonate is 70%, sodium chloride is 15%, potassium chloride is 15%), the balance is Sn and unavoidable impurities;

[0036] The preparation method of the above-mentioned low-temperature lead-free solder alloy is (1) industrially pure tin (Sn: 99.95wt%), industrially pure bismuth (Bi: 99.95wt%) and industrially pure zinc (Zn: 99.9wt%), and indium, Silver, copper, nickel, aluminum, gallium, and germanium were polished with 320-grit sandpaper to remove the oxide layer, and placed in a blast drying oven (40°C) for drying and preheating; (2) Alloy casting was performed using a stainless steel crucible, Before use, the surfaces of crucibles, slag removal tools, bell jars, etc. are cl...

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Abstract

The invention provides a low-temperature lead-free solder and its gravity casting method. The alloy is prepared from the following components in mass percentage: Zn 7%~11%, Bi 4.5%~10%, In 2%~8%, Ag 0.1%~1.5%, Cu 0.05%~0.5%, M 0.01%~2%, the refining agent of 0.1~0.5% of the total weight of metal raw materials, the balance is Sn and unavoidable impurities, and the mass percentage of Sn is not low At 67%, M is at least one element in RE or Ni, Al, Ga, Ge; the low-temperature alloy solder prepared by the present invention has excellent wettability and good mechanical properties, and the reliability of solder joints has been improved. Improvement, and low cost, can be applied to the welding of electronic components whose heating temperature is not suitable for high, to meet the needs of the development of light and thin electronic products.

Description

technical field [0001] The invention relates to a high-strength, high-reliability lead-free solder alloy and a preparation method thereof by gravity casting, belonging to the field of connecting materials for electronic products. Background technique [0002] With the continuous development and innovation of electronic manufacturing technology, electronic products are becoming thinner and smaller. Due to the shortness of the substrate, the pitch of solder joints is getting narrower and narrower, and the requirements for electronic packaging technology are gradually increasing. The reliability of solder joints is very important, and people are paying more attention to high-performance electronic packaging technology. In the process of manufacturing electronic products, the method of connecting components and substrates is brazing. The quality of brazing directly affects the quality of welding and is a very important link. However, lead and its compounds are toxic and will ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C13/00C22C1/02C22C1/06
Inventor 彭巨擘唐芸生鲍庆煌张家涛普友福陈光云罗晓斌贾元伟梁华鑫李俊
Owner 云南锡业集团(控股)有限责任公司研发中心
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