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Low-dielectric-constant polyimide hybridized film and application thereof

A low dielectric constant, polyimide technology, applied in the field of polymer composite materials, can solve the problems of poor size uniformity of nano-void structure, poor dimensional stability of polyimide, and decreased mechanical properties of polyimide, etc. The effect of reducing dielectric constant loss, increasing thermal stability, and reducing dielectric constant

Active Publication Date: 2019-06-28
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current research results show that the nanovoided structure is difficult to disperse uniformly in the polyimide matrix, the size uniformity of the nanovoided structure is poor, and the nanovoided structure is easy to collapse, which makes the dimensional stability of polyimide poor, especially not Suitable for large-area circuit substrates
In addition, the nanovoid structure can also cause a significant decrease in the mechanical properties of polyimide

Method used

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  • Low-dielectric-constant polyimide hybridized film and application thereof
  • Low-dielectric-constant polyimide hybridized film and application thereof

Examples

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Effect test

Embodiment 1

[0030] Put 100mL of 2mol / L sodium fluoride aqueous solution into a 200mL polytetrafluoroethylene liner, and then add 20g of porous MCM-41 (200nm) and 2g of polyethylene glycol (weight average molecular weight 6000) to the liner , Ultrasonic dispersion 6h. Then put the lining into another stainless steel reactor, seal the reactor, heat the reactor to 200°C, and keep it for 12 hours. After the reaction, the reactor is cooled to room temperature, and the supernatant is discarded. The precipitates were successively washed with distilled water, then vacuum-dried at 60°C, and ground into a fine powder to obtain surface fluorinated porous MCM-41 nanoparticles. Fully disperse 1 g of the above-mentioned fluorinated porous MCM-41 and 12 mmol 4,4-diaminodiphenyl ether in 40 mL of N,N-dimethylacetamide, sonicate for 4 hours, and then add 12 mmol 3,3 in three times within 30 min ',4,4'-biphenyltetracarboxylic dianhydride, and reacted at 25°C for 2 hours under the protection of nitrogen to...

Embodiment 2

[0032]Put 100mL of 2mol / L sodium fluoride aqueous solution into a 200mL polytetrafluoroethylene liner, and then add 20g of porous MCM-41 (250nm) and 2g of polyethylene glycol (weight average molecular weight 6000) to the liner , Ultrasonic dispersion 6h. Then put the lining into another stainless steel reactor, seal the reactor, heat the reactor to 200°C, and keep it for 12 hours. After the reaction, the reactor is cooled to room temperature, and the supernatant is discarded. The precipitate was washed successively with distilled water and ethanol, then dried in vacuum at 60°C, and ground into a fine powder to obtain surface fluorinated porous MCM-41 nanoparticles. Fully disperse 2g of the above-mentioned fluorinated porous MCM-41 and 12mmol 4,4-diaminodiphenyl ether in 40mL of N,N-dimethylacetamide, sonicate for 4h, and then add 12mmol 3,3 in three times within 30min ',4,4'-biphenyltetracarboxylic dianhydride, and reacted at 25°C for 2 hours under the protection of nitrogen ...

Embodiment 3

[0034] Put 100mL of 2mol / L sodium fluoride aqueous solution into a 200mL polytetrafluoroethylene liner, and then add 20g of porous MCM-41 (250nm) and 2g of polyethylene glycol (weight average molecular weight 6000) to the liner , Ultrasonic dispersion 6h. Then put the lining into another stainless steel reactor, seal the reactor, heat the reactor to 200°C, and keep it for 12 hours. After the reaction, the reactor is cooled to room temperature, and the supernatant is discarded. The precipitate was washed successively with distilled water and ethanol, then dried in vacuum at 60°C, and ground into a fine powder to obtain surface fluorinated porous MCM-41 nanoparticles. Fully disperse 4 g of the above-mentioned fluorinated porous MCM-41 and 12 mmol 4,4-diaminodiphenyl ether in 40 mL of N,N-dimethylacetamide, sonicate for 4 hours, and then add 12 mmol 3,3 in three times within 30 min ',4,4'-biphenyltetracarboxylic dianhydride, and reacted at 25°C for 2 hours under the protection o...

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Abstract

The invention discloses a low-dielectric-constant polyimide hybridized film and application thereof. The polyimide hybridized film is prepared by the following processes: fluorination of a porous nano-particle, hybridization of the fluorinated porous nano-particle and a polyimide precursor solution and film formation of a hybridized system. The porous nano-particle is one or more of silicon dioxide, zeolite, an MCM-41 molecular sieve and an SBA-15 molecular sieve. The porous nano-particle has a very low dielectric constant and is subjected to surface fluorination, so that the loss of the low dielectric constant of the porous nano-particle can be further reduced. By compounding the fluorinated porous nano-particle with the polyimide precursor solution, the fluorinated porous nano-particle has very good dispersity in a final polyimide film, and the dielectric constant of the hybridized film can be decreased. The polyimide hybridized film is low in dielectric constant and dielectric lossand high in mechanical performance and heat resistance and can be applied to high-frequency and high-speed electronic circuit fields such as 5G communication and high-speed automobile sensing systems.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and in particular relates to a low dielectric constant fluorinated porous nanoparticle / polyimide hybrid film and its application. Background technique [0002] Polyimide is a high-performance resin material. Based on its excellent heat resistance, mechanical properties, chemical corrosion resistance, high insulation properties, relatively low dielectric properties and low thermal expansion coefficient, it is widely used in engineering plastics, micro Electronic industry, communication technology, optoelectronic display technology and other fields. For example, polyimide film, as a dielectric material, plays an irreplaceable role in flexible printed circuit boards (FPCB). [0003] In recent years, with the development of 4G and 5G communication technology and the application of high-frequency and high-speed communication technology in the field of automotive sensing, more stringent requ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K9/02C08K7/26C08K7/24C08G73/10
Inventor 曹春李伟杰周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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