Circuit board, method of fabricating the circuit board, and electronic equipment

Abstract

The application provides a circuit board, a method of fabricating the same, an electronic component including the circuit board, and electronic equipment. Through the change of the liquid phase and gas phase of a cooling medium in a heat conducting layer in the circuit board, heat can be efficiently transferred from a high temperature zone to a low temperature zone, thereby enhancing the heat transfer effect of the circuit board. In the electronic equipment, by using the circuit board to connect different modules or structures, heat of a module with large heat generation can be transmitted toa position with low heat generation or a heat dissipation structure, thereby avoiding local high temperature in the electronic equipment, ensuring uniform heat throughout the electronic equipment andimproving the heat dissipation effect of the electronic equipment.

Description

technical field [0001] The present application relates to the field of electronic information technology, and in particular to a circuit board, a manufacturing method thereof, and electronic equipment including the circuit board. Background technique [0002] With the development of electronic information technology, there are more and more types of functional modules of electronic equipment. The functional modules are usually connected through circuit boards, and through the circuit boards, the heat is transferred from the high heat area to the low heat area, thus Solve the problem of overheating of modules that generate more heat. For example, in a smart phone, there are screen modules, camera modules, fingerprint modules, battery modules, wireless charging coil modules, etc. frame connection for heat dissipation. The circuit board is generally composed of an insulating layer and a copper layer (etched copper circuit layer). Since the thermal conductivity of the insulati...

AI Technical Summary

Problems solved by technology

However, since the thickness of the circuit board is generally thin, and the copper layer accounts for no more than 50% of the circuit board, the ability of heat conduction through the circuit board is limited, and the problem of local overheating of electronic equipment is prone to occur.

Images