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Preparation method of Sn-base composite solder sheet based on porous Ni/Cu alloy

A hybrid welding and alloy technology, applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of low coating adhesion, low welding efficiency, poor toughness, etc., and achieve strong performance adjustment and durability Good oxidation performance and controllable results

Active Publication Date: 2019-06-07
无锡继平新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problems of easy oxidation, low strength, poor toughness, low coating adhesion and low welding efficiency in the existing composite solder sheet, and provide a preparation of Sn-based composite solder sheet based on porous Ni / Cu alloy Method, the specific process is as follows: first prepare a uniform Cu metal layer on the porous Ni metal surface, and then sinter to obtain a porous Ni / Cu alloy; immerse the porous Ni / Cu alloy in molten Sn-based solder, take it out and roll it into a sheet. Can

Method used

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  • Preparation method of Sn-base composite solder sheet based on porous Ni/Cu alloy
  • Preparation method of Sn-base composite solder sheet based on porous Ni/Cu alloy
  • Preparation method of Sn-base composite solder sheet based on porous Ni/Cu alloy

Examples

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Embodiment 1

[0024] Put the porous Ni metal (porosity 98%) with a size of 40mm*25mm*1mm into dilute hydrochloric acid and alcohol with a concentration of 5% (volume fraction, the same below), take it out and put it into an ultrasonic cleaner for cleaning for about 5 minutes , electroplating after drying. The electroplating anode is pure copper plate, the cathode is porous Ni metal, the electroplating temperature is maintained at 40°C, the electroplating time is 30min, and the current density is 8A / dm 2 . After electroplating, the obtained porous Ni / Cu metal sheet was washed in deionized water and alcohol for 1 min, and then taken out and dried. Immediately transfer the porous metal sheet to a high-temperature sintering furnace, continuously pass in the protective gas Ar gas, heat at a heating rate of 10°C / min, the sintering peak temperature is 1000°C, and the holding time is 5h. After the sintering was completed, the furnace was cooled to 300°C, and the furnace was opened, and the porous...

Embodiment 2

[0027] Put the porous Ni metal (80% porosity) with a size of 40mm*25mm*1mm into dilute hydrochloric acid with a concentration of 5% and alcohol successively, take it out, put it into an ultrasonic cleaner for cleaning for about 5 minutes, blow it dry, and then perform electroplating. The electroplating anode is pure copper plate, the cathode is porous Ni metal, the electroplating temperature is maintained at 40°C, the electroplating time is 30min, and the current density is 4A / dm 2 . After electroplating, the obtained porous Ni / Cu metal sheet was washed in deionized water and alcohol for 1 min, and then taken out and dried. Immediately transfer the porous metal sheet to a high-temperature sintering furnace, continuously pass in protective gas Ar gas, heat at a heating rate of 10°C / min, the sintering peak temperature is 850°C, and the holding time is 2h. After the sintering was completed, the furnace was cooled to 300°C, and the furnace was opened, and the porous Ni / Cu alloy s...

Embodiment 3

[0030] Put the porous Ni metal (porosity 98%) with a size of 40mm*25mm*1mm into dilute hydrochloric acid and alcohol with a concentration of 5% successively, take it out, put it in an ultrasonic cleaner for cleaning for about 5min, blow it dry, and then perform electroplating. The electroplating anode is pure copper plate, the cathode is porous Ni metal, the electroplating temperature is maintained at 40°C, the electroplating time is 30min, and the current density is 12A / dm 2 . After electroplating, the obtained porous Ni / Cu metal sheet was washed in deionized water and alcohol for 1 min, and then taken out and dried. Immediately transfer the porous metal sheet to a high-temperature sintering furnace, continuously pass in protective gas Ar gas, heat at a heating rate of 10°C / min, the sintering peak temperature is 1000°C, and the holding time is 2h. After sintering, cool the furnace to 300°C and start the furnace, take out the porous Ni / Cu alloy sheet, and immediately immerse ...

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Abstract

The invention relates to a preparation method of a Sn-base composite solder sheet based on a porous Ni / Cu alloy. The preparation method comprises the steps that first of all, a layer of Cu is preparedon the surface of porous Ni metal, and then high-temperature sintering is carried out, so that mutual diffusion between Ni and Cu is facilitated, and bonding of Ni and Cu is further tight; and then the porous Ni / Cu alloy is immersed into the molten Sn-base solder, and finally is rolled into a foil. In the porous Ni / Cu alloy subjected to high-temperature sintering treatment, the bonding strength of Ni and Cu is higher and the oxidation resistance is better through the mutual diffusion between Ni and Cu, and the relatively high strength, good plasticity, high corrosion resistance and high ductility are shown. Along with change of sintering parameters and electroplating parameters, concentration distribution gradients of Ni and Cu in the porous Ni / Cu alloy are different, reaction between theporous Ni / Cu alloy and the Sn-base solder is rapider in the brazing process, and the soldering reliability is high.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a method for preparing a porous Ni / Cu alloy-based Sn-based composite solder sheet. Background technique [0002] With the development of electronic packaging technology, people have higher and higher performance requirements for small size, high power and high frequency power devices. As an important part of interconnect materials, solder has a direct impact on the performance of interconnect joints. Therefore, improving the strength and high-temperature performance of solder has gradually become an important direction for improving the quality of electronic device products. [0003] Porous metal-reinforced low-melting-point composite solder sheets have the advantages of high strength and good soldering performance, and have broad application prospects in the field of electronic packaging. The inventor team disclosed a metal foam composite solder sheet and its preparat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
Inventor 肖勇朱陈中何煌李丹李佳琪
Owner 无锡继平新材料科技有限公司
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