Method for growing gaas nanowires on si substrate
A nanowire and substrate technology, applied in the field of GaAs nanowires, can solve problems such as poor orientation, unsatisfactory device performance, and complicated processes
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Embodiment 1
[0032] (1) Selection of the substrate and its crystal orientation: the substrate used is p-Si(111), single-sided polished, with a thickness of 400±20μm, and a resistivity of 0.01 to 0.02Ω·cm;
[0033] (2) Cleaning and re-oxidation of the substrate surface: First, put the silicon wafer into a hydrofluoric acid solution with a concentration of 10% and perform ultrasonic etching for 2 minutes to remove the natural oxide layer on the surface of the Si substrate. Then put it into deionized water for ultrasonic cleaning for 1 minute to remove other impurities remaining on the Si substrate. Next, the Si substrate was immersed in 98% H 2 SO 4 : 30%H 2 O 2 =4:1 solution for 12 seconds, the thickness of the formed silicon dioxide reoxidation layer is about 1 nm. Finally, the Si substrate was rinsed with deionized water and absolute ethanol, and dried with high-purity nitrogen.
[0034] After the surface of the substrate is cleaned, the temperature of the substrate is slowly raised ...
Embodiment 2
[0040] The preparation method of GaAs nanowires grown on Si substrate without Ga droplets on top includes the following steps:
[0041] (1) Selection of the substrate and its crystal orientation: the substrate used is p-Si(111), single-sided polished, with a thickness of 400±20μm, and a resistivity of 0.01 to 0.02Ω·cm;
[0042] (2) Cleaning and re-oxidation of the substrate surface: First, put the silicon wafer into a hydrofluoric acid solution with a concentration of 10% and perform ultrasonic etching for 2 minutes to remove the natural oxide layer on the surface of the Si substrate. Then put it into deionized water for ultrasonic cleaning for 1 minute to remove other impurities remaining on the Si substrate. Then place the Si substrate in 98% H 2 SO 4 : 30%H 2 O 2 = 4:1 solution for 20 seconds, the thickness of the formed silicon dioxide reoxidation layer is about 1.5nm. Finally, the Si substrate was rinsed with deionized water and absolute ethanol, and dried with high-...
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