Low-temperature-resistant and heat-conducting insulating resin paint applicable to superconducting insulating material as well as preparation method and application of superconducting insulating material

Abstract

The invention discloses low-temperature-resistant and heat-conducting insulating resin paint applicable to a superconducting insulating material as well as a preparation method and an application of the superconducting insulating material. The paint is prepared from raw materials as follows: epoxy resin, polyether epoxy resin, an epoxy curing agent, polyurethane resin, acrylic resin, carboxyl-terminated butadiene-acrylonitrile rubber and nano modified boron nitride accounting for 2%-6.5% of raw materials by mass, wherein the feed mass ratio of the epoxy resin, the polyurethane resin, the acrylic resin and the carboxyl-terminated butadiene-acrylonitrile rubber is (5.5-17):(2-7):(0.8-2.5):(0.2-2.5):1. The preparation method comprises the steps as follows: firstly, mixing the epoxy resin andnano modified boron nitride, adding the polyurethane resin for a reaction, adding the polyether epoxy resin, the carboxyl-terminated butadiene-acrylonitrile rubber, the epoxy curing agent and acrylicresin to prepare the resin paint. The invention also discloses the application of the resin paint to the superconducting insulating material. The insulating resin paint has excellent electrical performance, processability, high thermal conductivity and better mechanical performance at low temperature.

Description

technical field [0001] The invention belongs to the field of superconducting insulation, and in particular relates to a superconducting insulating material, in particular to a low-temperature-resistant heat-conducting insulating resin varnish suitable for superconducting insulating materials and its preparation method and application. Background technique [0002] Epoxy resin has been widely used in superconducting insulation systems due to its excellent electrical insulation properties, excellent mechanical properties and good process properties. However, as a high-temperature superconducting insulating material, it needs to work at the temperature of liquid nitrogen for a long time, so the epoxy resin must have excellent low-temperature resistance mechanical properties. In addition, in order to prevent the phenomenon of losing the superconducting effect due to the heat transfer being blocked, causing damage to the entire superconducting device, the epoxy resin must also ha...

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Problems solved by technology

In addition, in order to prevent the phenomenon of losing the superconducting effect due to the heat transfer being blocked, causing damage to the entire superconducting device, the epoxy resin must also have good thermal conductivity, but due to the brittleness of the traditional epoxy resin at low temperatures characteristics, and the thermal conductivity at room temperature is low, only about 0.2W / mK, so it cannot meet the requirements of superconducting devices on the low-temperature mechanical properties and insulation and thermal conductivity of insulating resins

[0003] In view of the defects of existing epoxy resins such as high brittleness and low temperature resistance, some improvements have been made in the prior art, such as the Chinese invention patent CN 103740059B, which discloses a low temperature resistant insulating impregnated resin, by weight, The raw material formula of the low-temperature-resistant insulating impregnating resin is as follows: 100 parts of epoxy resin, 40-90 parts of polyurethane epoxy resin, 20-50 parts of phenolic hydroxyl-terminated low-molecular-weight polyphenylene ether resin with a number average molecular weight between 1500 and 2500 100-200 parts of low-viscosity polyether epoxy resin with a viscosity between 50-100 mPa.s at 25°C, 10-30 parts of epoxy curing agent, and the curing molding temperature of the low-temperature resistant insulating impregnated resin is 120-160 ℃; by weight, the polyurethane epoxy resin is made of the following raw materials: 100 parts of hydantoin epoxy resin, poly(tetramethylene-copolyethylene ether) glycol with a number average molecular weight of 1000~2000 15 to 30 parts, 1 to 3 parts of 1,4-butanediol, 5 to 10 parts of hexamethylene isocyanate; although this patent realizes that the epoxy resin-based dipping varnish has better low temperature resistance and better electrical Insulation performance, but it cannot achieve good heat conduction, and cannot meet the requirements of superconducting devices for insulating resin in terms of insulation and heat conduction performance

[0004] In order to improve the thermal conductivity, one of the common methods at present is to add thermal conductive fillers to the resin. However, there are still some technical difficulties in directly mixing or filling thermal conductive fillers into the resin matrix: (1) While not increasing the thermal resistance of the interface , it is not easy to achieve good compatibility between thermally conductive fillers and polymer matrix; (2) How to realize the addition of a small amount of thermally conductive fillers to make polymer matrix composites Improvement of thermal conductivity; (3) How to improve the thermal conductivity of polymers under the premise of maintaining the insulation properties of polymers

At present, there is no insulating resin varnish that can use epoxy resin as a matrix resin and possess high thermal conductivity and good mechanical properties at low temperatures.

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