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Ultraviolet light-responsive polymer adhesive and its preparation method and use

An ultraviolet light, responsive technology, applied in the preparation of organic compounds, adhesives, chemical instruments and methods, etc., can solve the problem of difficult to achieve high-efficiency and high-quality regioselective transfer, and achieve regioselective transfer. The effect of printing, easy availability of raw materials and cheap raw materials

Active Publication Date: 2020-06-09
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current mainstream transfer printing methods include rate-correlation-based, laser-based, microstructure-based, load-based, etc. These research work are either limited by the attachment conditions, or only focus on solving the process of extracting functional devices from seals, and it is difficult to achieve high Efficient, high-quality area-selective transfer

Method used

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  • Ultraviolet light-responsive polymer adhesive and its preparation method and use
  • Ultraviolet light-responsive polymer adhesive and its preparation method and use
  • Ultraviolet light-responsive polymer adhesive and its preparation method and use

Examples

Experimental program
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Effect test

preparation example Construction

[0053] The preparation method of the above UV-responsive polymer adhesive is simple and has sensitive viscosity adjustability. And, in the present invention, the raw material that is used to prepare polymer binder all can be purchased commercially, and for example raw material n-suberic acid can be purchased from Ti Xiai (TCI) company (commodity O0023), and other raw materials such as 2- Nitro-m-xylylenedimethanol, 2,5-dimethylnitrobenzene, and other starting materials used in their redox reactions are all commercially available chemical reagents commonly used in the art.

[0054] The polymer adhesive of the present invention can be used to improve the adhesion of the stamp or the stamp substrate, and when the stamp extracts the target functional device to be transferred from the parent substrate, it can provide high viscosity and realize 100% extraction of the functional device . After extraction, after being pasted to the target flexible substrate, the polymer adhesive unde...

Embodiment

[0061] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail through the following examples. However, it should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0062] Unless otherwise defined, all technical terms and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention, and the terms used in the description of the present invention herein are only to describe specific implementations The purpose of the example is not intended to limit the present invention.

[0063] All starting materials and reagents used in the following examples were obtained commercially and used without further treatment unless otherwise stated.

Synthetic example 1

[0066] In a 500 mL reactor, 8.2 g of 2-nitro-m-xylylenedimethanol (commercially obtained), 7.8 g of n-suberic acid, 360 mg of 4-dimethylaminopyridine, and 21 g of dicyclohexylcarbodiimide Dissolve in 75 mL of dry DMF. After vacuumizing the reactor three times and replacing the nitrogen atmosphere, the polycondensation reaction was carried out by heating to 80° C. in an oil bath for 72 hours in a nitrogen atmosphere. After the reaction was completed, the reaction mixture was cooled to room temperature and diluted with 50 mL of anhydrous DMF, followed by gravity filtration. The obtained filtrate was concentrated to 5 mL, and then precipitated in 200 mL of anhydrous ether, and the precipitate (ie polymer) was collected and dried at room temperature for 12 hours to obtain the desired UV-responsive polymer binder.

[0067] The molecular weight of the obtained polymer was measured by gel permeation chromatography GPC (gel permeation chromatography model: Waters 1515, manufacturer: ...

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Abstract

The invention discloses an ultraviolet-responsive polymer adhesive with a structure shown as formula (I), a preparation method and an application thereof, wherein n represents degree of polymerizationand is an integer from 5 to 18. The ultraviolet-responsive polymer adhesive disclosed by the invention can be prepared according to a method with low cost, simple process and mild conditions. Besides, the polymer adhesive is capable of degrading polymer chain by breaking o-nitrobenzyl ester bond by responding to ultraviolet irradiation, so that the viscosity can be reduced and even eliminated. Thus, control on interface adhesiveness of functional component and substrate during the preparation process of micro-electronics and semiconductors can be realized, and the polymer adhesive can be applied to transferring process for preparing functional electronic devices and especially has an ultrahigh application value in the field of micro-electronics and semiconductor processing.

Description

technical field [0001] The invention relates to the fields of adhesives and microelectronics and semiconductor processing, in particular to an ultraviolet light responsive polymer adhesive and its preparation method and application. Background technique [0002] Electronic integrated devices based on inorganic semiconductor materials are the most important components of modern social information systems. Traditional inorganic electronic integrated devices are mainly composed of brittle materials. Their hard and brittle characteristics make them unable to bend and stretch, and difficult to withstand large deformations. . With the advancement of society and the increasing development of electronic technology, traditional brittle materials can no longer meet the needs of large-area heterogeneous heterogeneous integration, and are not suitable for conformal bonding with non-planar tissues such as the human body. Therefore, the development of flexible electronic devices that can...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J167/02C08G63/685C07C201/12C07C205/42
Inventor 徐航勋张杭张颖
Owner UNIV OF SCI & TECH OF CHINA
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