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High reliability PTC thermistor

A thermistor and reliability technology, applied in the direction of non-adjustable metal resistors, resistors, resistors with positive temperature coefficients, etc., can solve the problems of low device reliability, low withstand voltage level, device failure, etc. , to prevent the infiltration of water and water vapor, ensure safety performance, and improve stability

Active Publication Date: 2019-04-26
苏州团芯终端有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the existing PTC thermistor is used in the field of high working temperature, there is a problem that the withstand voltage level is not high and the device fails, resulting in low reliability of the device, and it is easy to be impacted by a large current and burst easily, posing a safety hazard

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A high-reliability PTC thermistor, comprising a PTC chip, a first electrode pasted on the upper surface of the PTC chip, a second electrode pasted on the lower surface of the PTC chip, and soldered to the surfaces of the first electrode and the second electrode Electrode leads, the leads are tinned leads; the diameter of the leads is 0.3mm, the bottom of the leads is provided with an overload protector, and the outer side of the welding part of the PTC chip, the first electrode, the second electrode and the leads is wrapped with an encapsulation layer from inside to outside , the encapsulation layer is a glass layer; there is a gap between the PTC chip and the encapsulation layer;

[0037] Wherein, the PTC chip includes the following materials by weight:

[0038]

[0039]

[0040] A cooling layer is provided outside the encapsulation layer, and the cooling layer includes 30wt% bamboo fiber, 30wt% titanium dioxide, 20wt% barium sulfate, and 20wt% zinc oxide. A moi...

Embodiment 2

[0043] A high-reliability PTC thermistor, which includes a PTC chip, a first electrode attached to the upper surface of the PTC chip, a second electrode attached to the lower surface of the PTC chip, and welded to the first electrode and the second electrode The electrode leads on the surface are tin-plated leads with a diameter of 0.6mm. An overload protector is installed at the bottom of the leads. The encapsulation layer, the encapsulation layer is a glass layer; there is a gap between the PTC chip and the encapsulation layer;

[0044] Wherein, the PTC chip includes the following materials by weight:

[0045]

[0046]A cooling layer is provided outside the encapsulation layer, and the cooling layer includes 40wt% bamboo fiber, 20wt% titanium dioxide, 22wt% barium sulfate, and 18t% zinc oxide. A moisture-proof layer is also provided outside the cooling layer, and the moisture-proof layer is an acrylic resin layer. The gap is provided with an explosion-proof layer; the e...

Embodiment 3

[0048] A high-reliability PTC thermistor, comprising a PTC chip, a first electrode pasted on the upper surface of the PTC chip, a second electrode pasted on the lower surface of the PTC chip, and soldered to the surfaces of the first electrode and the second electrode Electrode leads, the leads are tinned leads; the diameter of the leads is 0.4mm, the bottom of the leads is provided with an overload protector, and the outer side of the welding part of the PTC chip, the first electrode, the second electrode and the leads is wrapped with an encapsulation layer from inside to outside ; There is a gap between the PTC chip and the encapsulation layer;

[0049] Wherein, the PTC chip includes the following materials by weight:

[0050]

[0051] A cooling layer is provided outside the encapsulation layer, and the cooling layer includes 35wt% bamboo fiber, 25wt% titanium dioxide, 25wt% barium sulfate, and 15wt% zinc oxide. A moisture-proof layer is also provided outside the cooling...

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PUM

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Abstract

The invention relates to a high reliabiliy PTC thermistor comprising a PTC chip, a first electrode attached to the upper surface of the PTC chip, a second electrode attached to the lower surface of the PTC chip and an electrode lead soldered to the surfaces to the first electrode and the second electrode. The outside of a solder joint of the PTC chip, the first electrode, the second electrode andthe lead is wrapped with an encapsulation layer from the inside to the outside. A gap is left between the PTC chip and the encapsulation layer. The thermistor improves the capability to withstand external impact by means of the encapsulation layer. By means of an explosion-proof layer, a cooling layer and a moisture-proof layer, the thermistor can be better protected, the capability to withstand the external impact is improved, and better stability can be achieved.

Description

technical field [0001] The invention relates to the technical field of thermistors, in particular to a highly reliable PTC thermistor. Background technique [0002] Conductive composite materials with positive temperature coefficient (PTC) characteristics change the resistivity of PTC by several orders of magnitude before and after the critical transition temperature, that is, the resistance of PTC can increase with the increase of the ambient temperature in which it is used, so that it can be Reduce or cut off the current at higher temperatures to protect against overcurrent and overtemperature. At present, this type of device has been widely used in various circuit protection devices, such as lithium-ion batteries, instrument coils, integrated circuits, etc. When the existing PTC thermistor is used in a field with high working temperature, there is a problem that the withstand voltage level is not high and the device fails, resulting in low reliability of the device, and i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C1/032H01C1/08H01C1/084H01C1/16H01C7/02
CPCH01C1/032H01C1/08H01C1/084H01C1/16H01C7/023H01C7/027
Inventor 苏华
Owner 苏州团芯终端有限公司
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