A kind of manufacturing method of lead-free tg140 ​​copper clad laminate

Abstract

The invention discloses a method for making lead-free TG140 copper-clad laminates, which belongs to the technical field of copper-clad laminates. Oxygen resin, high-bromine epoxy resin, four-functional epoxy resin, novolak resin, ketone organic solvent, propylene glycol methyl ether, cyclohexanone, aluminum hydroxide and silicon dioxide were added to the dissolution tank in sequence and stirred evenly; After leaving it for 15 minutes, dissolve the imidazole accelerator with propylene glycol methyl ether and add it to the dissolving tank, stir until it is evenly mixed, then let it stand and mature for 6-10 hours to obtain the glue; soak the glass fiber cloth in the glue and then pass through Squeeze the rubber roller to squeeze out the excess glue, then enter the drying box for drying to remove the solvent, and obtain the prepreg; the prepreg products are stacked and prefabricated according to the process requirements, and copper foil is laid on top and bottom, and combined according to the process requirements, it is transported into the heat Perform hot pressing in a press to obtain lead-free TG140 copper-clad laminates; the present invention aims to provide a method for manufacturing lead-free TG140 copper-clad laminates.

Description

technical field [0001] The present invention relates to a copper-clad laminate, and more specifically, to a method for manufacturing a lead-free TG140 copper-clad laminate. Background technique [0002] The existing ordinary TG140 copper clad laminates are made of ordinary TG140 copper clad laminates due to the use of epoxy resin as the main resin to react with amine curing agents such as dicyandiamide. The disadvantages mainly include low glass transition point temperature (TG for short) and poor heat resistance , Poor chemical resistance and so on. At present, the European Union advocates the use of environmentally friendly materials. Lead is prohibited from being used in PCB processing, and other alloy materials with higher melting points are used in the tin-spraying process. As a result, ordinary TG140 copper-clad laminates cannot meet the high-temperature operation requirements of PCBs. Generally, the industry will use higher TG150 and TG170 copper clad laminates as su...

AI Technical Summary

Problems solved by technology

[0002] The existing ordinary TG140 copper clad laminates are made of ordinary TG140 copper clad laminates due to the use of epoxy resin as the main resin to react with amine curing agents such as dicyandiamide. The disadvantages mainly include low glass transition point temperature (TG for short) and poor heat resistance , poor chemical resistance, etc.

At present, the European Union advocates the use of environmentally friendly materials. Lead is prohibited from being used in PCB processing, and other alloy materials with higher melting points are used in the tin-spraying process. As a result, ordinary TG140 copper-clad laminates cannot meet the high-temperature operation requirements of PCBs. Generally, the industry will use higher TG150 and TG170 copper clad laminates as substitutes, but the production cost of PCB will increase a lot, and the chemical resistance of ordinary TG140 copper clad laminates is poor. The resin on the surface of the copper area will be bitten off, and abnormal white spots will appear, so thick copper foil plates are prone to white spots

At the same time, after the process of PCB processing, the glass cloth leaks out due to solvent erosion, and the removal of some surface resin will also cause white spots on the substrate.

Therefore, the poor chemical resistance of ordinary TG140 copper clad laminates needs to be further improved

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