Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

On-chip secondary power supply structure taking band gap reference structure as core

A technology of secondary power supply and reference structure, which is applied in the direction of adjusting electrical variables, control/regulation systems, instruments, etc., and can solve problems such as high requirements for process parameters and process stability, large output voltage temperature changes, and large output voltage differences. , to achieve the effect of reducing influence, small load adjustment rate and improving accuracy

Active Publication Date: 2019-04-16
XIAN MICROELECTRONICS TECH INST
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, the Zener voltage regulator was often used as the core to form a secondary power supply structure, but because the device has high requirements on process parameters and process stability, and the output voltage varies greatly with temperature, the Zener voltage regulator is used in practical applications. The output voltage of the secondary power supply structure varies greatly between different process batches, and is more sensitive to operating temperature

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • On-chip secondary power supply structure taking band gap reference structure as core
  • On-chip secondary power supply structure taking band gap reference structure as core
  • On-chip secondary power supply structure taking band gap reference structure as core

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0040] Such as figure 1 As shown, the circuit of the on-chip secondary power supply structure of the present invention includes a bandgap reference circuit, a proportional amplification circuit and a driving circuit module. Taking the bandgap reference circuit as the core structure, and adding a proportional amplifier circuit and a driving circuit module on the basis, a secondary power supply structure with a certain driving capability is obtained. The implementation circuit has a simple structure and is easy to be transplanted in various processes. The structure can be adapted to various application conditions and has a good temperature coefficient to meet the requirement of normal operation of the circuit under extreme temperature conditions.

[0041] figure 1 The part in the middle recta...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the analog integrated on-chip secondary power supply technology field and especially relates to an on-chip secondary power supply structure taking a band gap reference structure as a core. A band gap reference is taken as a core structure, a band gap reference voltage is amplified to a required secondary power supply voltage through a proportional resistor, and a driving line module is added on the above basis so that a secondary power supply structure with a certain driving capability is obtained. The structure of the circuit is simple, the structure is easy to be transplanted on various technologies, the structure can adapt to various application conditions, a good temperature coefficient can be possessed, and the demand of normal work under an extreme temperature condition can be satisfied.

Description

technical field [0001] The invention belongs to the technical field of analog integrated on-chip secondary power supply, and in particular relates to an on-chip secondary power supply structure with a bandgap reference structure as the core. Background technique [0002] The on-chip secondary power supply technology can realize secondary power supply for drivers or circuits that require an internal secondary power structure. It usually acts on the logic control part, enabling it to transmit logic signals at a lower operating voltage. The secondary power circuit It has become an important component module to increase the operating frequency of the circuit and reduce the heating power during operation, and its performance directly determines the quality of the circuit performance to a certain extent. In the past, the Zener voltage regulator was often used as the core to form a secondary power supply structure, but because the device has high requirements on process parameters ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05F1/56
CPCG05F1/56
Inventor 王漪婷张强王勇
Owner XIAN MICROELECTRONICS TECH INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products