Copper-clad plate with high thermal conductivity and preparation method thereof

Abstract

The invention discloses a preparation method of a copper-clad plate with high thermal conductivity. The preparation method includes the steps that 2-aminophenol, sodium hydroxide and ethyl alcohol aremixed to obtain a solution A; a formaldehyde solution is added into the solution A, the pH value is adjusted to be neutral, and then polyethylene glycol is added to obtain a solution B; F127 is addedinto the solution B, coating, drying, heating and heat insulation are conducted, and then the mixture is soaked in an ethanol solution of maleic acid and pyrrolidine and then is washed and dried to obtain a solid phase D; the solid phase D is soaked in an ethanol solution of chloroiridic aicd, ethyl orthosilicate and isopropyl alcohol and then is dried to obtain a solid phase E; the solid phase Eis heated to obtain a solid phase F; the solid phase F is mixed with epoxy resin, liquid carboxylated nitrile rubber, dicyandiamide, 1-methylimidazole and acetone, and coating and drying are conducted to obtain resin coated copper foil and a resin coated aluminium matrix; the copper foil and the aluminium matrix fit each other and are compacted, and vacuum pressing forming is conducted to obtainthe copper-clad plate. By adopting the preparation method of the copper-clad plate with high thermal conductivity, a copper-clad plate preparation technology is optimized, and compared with the priorart, the copper-clad plate has higher thermal conductivity and breakdown voltage.

Description

technical field [0001] The invention belongs to the technical field of PCB, and in particular relates to a high thermal conductivity copper clad laminate and a preparation method thereof. Background technique [0002] In order to achieve "small, thin, short, and light", the printed circuit board (PCB) must develop in the direction of high-density wiring, which causes heat dissipation problems of PCB components. Copper clad laminates such as conventional FR-4 and CEM-3 are poor thermal conductors, and the heat is not easy to dissipate in time. If the electronic equipment is locally heated but cannot be eliminated in a timely and effective manner, it will inevitably lead to the failure of the electronic components at high temperature. Therefore, the thermally conductive copper clad laminate with high thermal conductivity and long-term stable use is highly praised by the market. [0003] Thermally conductive copper clad laminate is a new type of copper clad laminate with a cer...

AI Technical Summary

Problems solved by technology

In the prior art, in order to improve the thermal conductivity of the heat-conducting insulating layer, the amount of heat-conducting particles is often increased, which will cause the viscosity of the glue to increase, processing difficulties, poor mechanical strength and toughness of the matrix, and reduced bonding performance, which will bring problems to the system. More voids, reducing electrical breakdown and insulation performance

Therefore, increasing the amount of heat-conducting particles in order to pursue high thermal conductivity one-sidedly will affect and destroy the balance between other physical performance indicators, and the overall performance of the prepared heat-conducting copper-clad laminate is poor.