High-temperature sintered conductive silver paste and preparation method thereof
A technology of conductive silver paste and high temperature sintering, which is used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Problems such as the adhesion of the silver film to the substrate, to achieve the effect of enhancing capacitance, enhancing conductivity, and increasing connection
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] Take 68 parts of spherical or flake silver powder with a particle size of 0.1-5 microns, 10 parts of lead-free low-temperature molten glass powder, 8 parts of ethyl cellulose, and 10 parts of organic solvent, of which
[0023] Lead-free low-temperature molten glass powder is composed of the following components: Bi 2 o 3 35%, B 2 o 3 20%, ZnO 10%, SiO 2 22%, Al 2 o 3 2%, CaO 6%, V 2 o 5 5%, choose lead-free low-temperature molten glass powder with a particle size of 4 μm and a softening temperature of 650°C;
[0024] Organic solvents include 6 parts of terpineol, 2.5 parts of butyl carbitol, and 1.5 parts of butyl carbitol acetate;
[0025] S1. Mix organic solvents: 6 parts of terpineol, 2.5 parts of butyl carbitol, and 1.5 parts of butyl carbitol acetate to obtain a mixed organic solvent;
[0026] S2, fully mixing ethyl cellulose with a mixed organic solvent to form a viscous liquid;
[0027] S3. Mixing treatment: fully stir and mix the viscous liquid obtai...
Embodiment 2
[0031] Take 65 parts of spherical or flake silver powder with a particle size of 0.1-5 microns, 6 parts of lead-free low-temperature molten glass powder, 5 parts of ethyl cellulose, and 5 parts of organic solvent, of which
[0032] Lead-free low-temperature molten glass powder is composed of the following components: Bi 2 o 3 35%, B 2 o 3 20%, ZnO 10%, SiO 2 22%, Al 2 o 3 2%, CaO 6%, V 2 o 5 5%, the particle size of lead-free low-temperature molten glass powder is selected as 3 μm, and the softening temperature is 390 ° C;
[0033] Organic solvents include 2.75 parts of terpineol, 1.5 parts of butyl carbitol, and 0.75 parts of butyl carbitol acetate;
[0034] S1. Mix organic solvents: 2.75 parts of terpineol, 1.5 parts of butyl carbitol, and 0.75 parts of butyl carbitol acetate to obtain a mixed organic solvent;
[0035] S2, fully mixing ethyl cellulose with a mixed organic solvent to form a viscous liquid;
[0036] S3. Mixing treatment: fully stir and mix the visc...
Embodiment 3
[0039] Take 70 parts of spherical or flake silver powder with a particle size of 0.1-5 microns, 12 parts of lead-free low-temperature molten glass powder, 10 parts of ethyl cellulose, and 15 parts of organic solvent, of which
[0040] Lead-free low-temperature molten glass powder is composed of the following components: Bi 2 o 3 35%, B 2 o 3 20%, ZnO 10%, SiO 2 22%, Al 2 o 3 2%, CaO 6%, V 2 o 5 5%, choose lead-free low-temperature molten glass powder with a particle size of 5 μm and a softening temperature of 780°C;
[0041] Organic solvents include 9.75 parts of terpineol, 3 parts of butyl carbitol, and 2 parts of butyl carbitol acetate;
[0042] S1. Mix organic solvents: 9.75 parts of terpineol, 3 parts of butyl carbitol, and 2 parts of butyl carbitol acetate to obtain a mixed organic solvent;
[0043] S2, fully mixing ethyl cellulose with a mixed organic solvent to form a viscous liquid;
[0044] S3. Mixing treatment: fully stir and mix the viscous liquid obtained...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
softening point | aaaaa | aaaaa |
viscosity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com