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Alloy nanometer particle soldering paste and preparation method thereof

A technology of alloy nanoparticles and solder paste, which is applied in the fields of nanotechnology and microelectronics packaging, can solve the problems of unsolved tin reflow and electromigration, poor resistance to ion migration, and increased sintering temperature, and achieves easy control of process parameters and cost. Low, enhanced antioxidant effect

Inactive Publication Date: 2019-02-19
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Invention patents CN201010301224.8, CN201010301221.4, and CN201010301190.2 enhance the plasticity of lead-free tin solder paste by adding nickel, iron and silver nanoparticles respectively, and inhibit the growth of intermetallic compounds at the solder joint interface, thereby improving mechanical properties and stability However, problems such as tin reflow and electromigration at high temperatures have not been resolved
However, both silver and copper nanoparticle solder pastes have some unavoidable defects, such as expensive silver and poor ion migration resistance, copper nanoparticles are easily oxidized, and surface oxides will significantly increase the sintering temperature and reduce electrical conductivity.
Some researchers have inhibited the oxidation of copper nanoparticles by preparing core-shell nanoparticles (copper-silver, copper-nickel and copper-tin), but the preparation process of this core-shell structure is complicated, and the core-shell structure produces phase separation at high temperature. It will also further reduce the electrical conductivity; on the other hand, alloy nanoparticles can well balance the advantages and disadvantages of various metals, such as copper-silver alloy nanoparticles not only have good thermal conductivity and electrical conductivity, but also have good oxidation resistance properties and ion migration resistance

Method used

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  • Alloy nanometer particle soldering paste and preparation method thereof
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  • Alloy nanometer particle soldering paste and preparation method thereof

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preparation example Construction

[0030] The present invention proposes a kind of preparation method of alloy nanoparticle solder paste, and its preparation process is as follows figure 1 As shown, it specifically includes the following steps:

[0031] (a) completely dissolving the metal salt and the stabilizer in a solvent to obtain a metal salt solution, adding a reducing agent to the metal salt solution and stirring to make it fully react to obtain an alloy nanoparticle suspension;

[0032] (b) performing solid-liquid separation of the alloy nanoparticle suspension prepared in step (a), preferably by centrifugation to obtain a precipitate, washing the precipitate with a cleaning agent, and drying it to obtain alloy nanoparticles;

[0033] (c) adding the alloy nanoparticles prepared in the step (b) to an organic thickener, and after vacuum stirring and defoaming treatment, an alloy nanoparticle solder paste is prepared.

[0034] Further, the cation of the metal salt in the step (a) is preferably any two or ...

Embodiment 1

[0044] (a) Copper formate and silver acetate are used as metal salts, and after mixing with isopropanolamine, they are completely dissolved in ethylene glycol to obtain a metal salt solution, and then the reducing agent hydrazine hydrate is added to the metal salt solution and continued at room temperature Stir for 24 hours to fully react to obtain alloy nanoparticle suspension, wherein the molar ratio of metal salt to isopropanolamine is 1:10, the molar ratio of metal salt to hydrazine hydrate is 1:10, and the molar ratio of copper formate and silver acetate is The molar ratio is 4:1;

[0045] (b) Centrifuge the alloy nanoparticle suspension prepared in step (a) to obtain a precipitate, wash it sequentially with N,N-dimethylacetamide and toluene, and then vacuum-dry it at 80°C After 2 hours, alloy nanoparticles with a particle size of 50nm to 200nm were obtained, denoted as HJ-1;

[0046] (c) Add the HJ-1 prepared in step (b) to glycerol, and after vacuum stirring and defoam...

Embodiment 2

[0049] (a) Copper acetate and silver acetate are used as metal salts, mixed with isopropanolamine and completely dissolved in ethylene glycol to obtain a metal salt solution, and then the reducing agent sodium borohydride is added to the metal salt solution and heated at 5°C Stir continuously for 6 hours to make it fully react to obtain alloy nanoparticle suspension, wherein the molar ratio of metal salt to isopropanolamine is 1:20, the molar ratio of metal salt to sodium borohydride is 1:8, copper acetate and The molar ratio of silver acetate is 7:3;

[0050] (b) Filtrating the alloy nanoparticle suspension prepared in step (a) to obtain a precipitate, washing it with pentane, and then vacuum-drying it at 70° C. for 8 hours to obtain a particle size of 5 nm to 100 nm alloy nanoparticles, denoted as HJ-2;

[0051] (c) Add the HJ-2 prepared in step (b) to ethylene glycol, and after vacuum stirring and defoaming treatment, an alloy nanoparticle solder paste is prepared, wherein...

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Abstract

The invention belongs to the field of nanometer technology and microelectronic packaging and discloses alloy nanometer particle soldering paste and a preparation method thereof. The method includes the specific steps that metal salt and a stabilizing agent are completely dissolved in a solvent to prepare a metal salt solution, a reducing agent is added in the metal salt solution and is stirred, and is enabled to perform a full reaction, and an alloy nanometer particle suspension is acquired; the alloy nanometer particle suspension is subjected to solid-liquid separation, precipitate is obtained, the precipitate is washed with a washing agent, and then drying is performed so that alloy nanometer particles can be obtained; and the alloy nanometer particles are added into an organic thickening agent, and after vacuum stirring and bubble removing treating, the alloy nanometer particle soldering paste is made. According to the alloy nanometer particle soldering paste and the preparation method thereof, the alloy nanometer particles are prepared by adopting a liquid phase reducing method, the process is simple, control is easy, and cost is low; and the stabilizing agent is added in whilethe metal salt solution is prepared, agglomeration and oxidization of the particles can be effectively avoided, and the oxidization resistance of the alloy nanometer particles is enhanced.

Description

technical field [0001] The invention belongs to the field of nanotechnology and microelectronic packaging, and more specifically relates to an alloy nanoparticle solder paste and a preparation method thereof. Background technique [0002] With the continuous development of high density, high power and miniaturization of electronic devices, more stringent requirements are put forward for the high temperature resistance and service stability of solder. Although lead-containing high-temperature solder has good high-temperature resistance and is widely used in the field of electronic packaging, lead-containing solder has serious harm to the environment and human health, and does not conform to the development trend of energy conservation, environmental protection and green manufacturing. Although the lead-free solders that have been developed can avoid the use of lead-containing solders, they still have many disadvantages, such as the high brittleness of bismuth-based solders, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/36
Inventor 陈明祥牟运彭洋刘佳欣程浩
Owner HUAZHONG UNIV OF SCI & TECH
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