Charge storage type insulated gate bipolar transistor and preparation method thereof
A bipolar transistor and charge storage technology, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as belt bending, increased concentration, and low forward conduction voltage drop, so as to reduce Vceon and reduce Effects of forward voltage drop, enhanced withstand voltage characteristics, and reliability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0050] This embodiment provides a strained Si~Si 1-x Ge x Insulated gate bipolar transistor with homogeneous heterojunction charge storage layer, its cell structure includes: collector metal, P-type collector region, N-type field stop layer, N-drift region, N-type charge storage layer, P-type Base region, P+ emitter region, N+ emitter region, trench gate structure and emitter metal; collector metal is arranged on the back of P-type collector region; N-type field stop layer is arranged on the front of P-type collector region; N- The drift region is arranged on the front of the N-type field stop layer; the P-type base region is arranged on the top layer of the N-drift region; the P+ emitter region and the N+ emitter region in contact with both sides of the P+ emitter region are arranged side by side on the top layer of the P-type base region ; There is an N-type charge storage layer between the P-type base region and the N-drift region; the trench gate structure includes a tren...
Embodiment 2
[0055] This embodiment provides a strained Si~Si 1-x Ge x For the insulated gate bipolar transistor of the homogeneous heterojunction charge storage layer, the structure of this embodiment is the same as that of embodiment 1 except that a P-type layer with a junction depth of 0.5-1 μm is introduced at the bottom of the trench gate structure.
[0056] This embodiment introduces a P-type layer connected to the gate electrode through a gate dielectric layer, and the P-type layer extends laterally to both sides to the N-drift region below the heterojunction N-type charge storage layer, thereby shielding the N-type charge The impact of negative charges in the storage layer improves the concentration of the electric field at the bottom of the trench and improves the breakdown voltage and reliability of the device.
Embodiment 3
[0058] This embodiment provides a strained Si~Si 1-x Ge x The insulated gate bipolar transistor of the homogeneous heterojunction charge storage layer is the same as that of Embodiment 2 except that a split electrode and a split electrode dielectric layer are introduced into the trench gate structure to form a split trench gate structure.
[0059]The gate electrode depth in the split trench gate structure is greater than the junction depth of the P-type base region and smaller than the junction depth of the N-type charge storage layer; the depth of the split electrode is greater than the junction depth of the N-type charge storage layer; the split The electrode is connected to the gate electrode through the gate dielectric layer, and is connected to the N-type charge storage layer and the N-drift region through the split electrode dielectric layer; the thickness of the split electrode dielectric layer is greater than the thickness of the gate dielectric layer; the split electr...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com