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Multi-layer composite photovoltaic packaging adhesive film resistant to PID (potential induced degradation) as well as preparation method and application

A potential-induced decay, multi-layer composite technology, applied in photovoltaic power generation, thin film/sheet adhesives, circuits, etc., can solve the problem of unsatisfactory anti-PID effect of double-sided cell modules, and unfavorable cost reduction of photovoltaic modules. , The problem of high price of polyolefin resin raw materials, to achieve the effect of low water vapor transmission rate, enhanced anti-PID performance, and improved anti-PID performance

Active Publication Date: 2019-02-15
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN105950039 A discloses an anti-PID polyolefin adhesive film for solar modules, using polyolefin POE instead of EVA as packaging material to increase the volume resistivity of the adhesive film, but the raw material price of polyolefin resin is relatively high, which increases the The packaging cost of components, and the POE material has a large cohesive energy and poor adhesion to glass. Long-term outdoor use is prone to delamination of the adhesive film and glass
Patent CN103421443 B provides a kind of encapsulant film for solar cell module, and described encapsulant film comprises polyolefin barrier layer and is positioned at the first adhesive layer and the second adhesive layer (siloxane graft polymer Composition with ethylene-alpha olefin or composition of siloxane graft polymer and EVA), the encapsulation adhesive film can solve the adhesive force between the adhesive film and glass and battery sheet due to the introduction of siloxane graft copolymer Poor problem, but the encapsulation film can only be used for the anti-PID of conventional cell components, and the anti-PID effect of double-sided cell components is not ideal
In terms of packaging material production process: Dupont, USA TM The PID protective film of DuPont ionomer is proposed. The PID protective film is prepared based on the ionomeric polymer technology verified by more than 15 years of crystal silicon module experiments. The thickness is about 50 μm, and it is placed between the photovoltaic glass and the EVA encapsulation film. It can effectively block the migration of sodium ions to the surface of the cell and completely solve the PID problem, but the material is relatively expensive, which limits its promotion and application in the market
In terms of cell production technology, CN104576826 B discloses a cell post-treatment method, which prepares a non-stick coating on the surface of the aluminum back field to improve the compactness of the silicon nitride film, and a subsequent high-temperature annealing process to improve the anti-PID ability of the cell , but this method increases the production cost of cells, which is not conducive to the cost reduction of photovoltaic modules

Method used

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  • Multi-layer composite photovoltaic packaging adhesive film resistant to PID (potential induced degradation) as well as preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides a packaging material with anti-PID performance.

[0031] Adhesive layer: in terms of mass fraction, get 100 parts of VA (vinyl acetate) ethylene-vinyl acetate copolymer with a mass content of 21%, add 0.8 part of tert-butyl peroxyisopropyl carbonate, 0.8 part of triethylenedi Alcohol dimethacrylate, 0.1 part of 2-hydroxy-4-n-octyloxybenzophenone, 0.2 part of vinyltriethoxysilane, 0.1 part of bis(2,2,6,6-tetramethyl- 4-piperidinyl) sebacate.

[0032] Barrier layer: by mass fraction, take 100 parts of ethylene-octene copolymer, 5 parts of polyethylene oxide, 0.5 part of pentaerythritol tetraacrylate, 0.1 part of 2,5-dimethyl 2,5- Bis(tert-butylperoxy)hexane, 0.1 part of 2-hydroxy-4-n-octyloxybenzophenone, 0.2 part of vinyltriethoxysilane, 0.1 part of bis(2,2,6,6- Tetramethyl-4-piperidinyl) sebacate.

[0033] After mixing the above-mentioned resin and additive compositions of the bonding layer and the barrier layer, they are fed into different e...

Embodiment 2

[0037] This embodiment provides a packaging material with anti-PID performance.

[0038] Adhesive layer: in terms of mass fraction, get 100 parts of VA (vinyl acetate) mass content as 26% ethylene-vinyl acetate copolymer, add 0.8 parts of tert-butyl peroxyisopropyl carbonate, 10 parts of ethoxylated pentaerythritol Tetraacrylate, 0.4 parts of 2-(2'-hydroxy-3',5'-dipentylphenyl)benzotriazole, 3 parts of aminopropyltriisopropoxysilane, 1 part of bis(2,2 ,6,6-Tetramethyl-4-piperidinyl) sebacate.

[0039] Barrier layer: in terms of mass fraction, get 100 parts of ethylene-octene copolymer grafted maleic anhydride (grafting rate 5%), 5 parts of polyether ester amide, 0.5 part of triethylene glycol dimethacrylic acid ester, 0.1 part of 2,5-dimethyl 2,5-bis(tert-butylperoxy)hexane, 0.1 part of 2-hydroxy-4-n-octyloxybenzophenone, 0.2 part of aminopropyltris Isopropoxysilane, 0.5 part of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate.

[0040] The film is formed by multi-layer co-e...

Embodiment 3

[0044] This embodiment provides a packaging material with anti-PID performance.

[0045] Adhesive layer 1: In terms of mass fraction, take 100 parts of ethylene-vinyl acetate copolymer with a mass content of VA (vinyl acetate) of 12%, add 1 part of 2,5-dimethyl 2,5-bis( tert-butylperoxy)hexane, 5 parts of ethoxylated trimethylolpropane triacrylate, 1 part of aminopropyltrimethoxysilane, 0.1 part of 2-hydroxy-4-methoxybenzophenone, 0.1 part of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate.

[0046] Barrier layer: in terms of mass fraction, get 100 parts of ethylene-butene copolymer grafted vinyltrimethoxysilane (grafting rate 20%), 5 parts of methoxy polyethanol methacrylate copolymer, 0.5 Parts of ethoxylated trimethylolpropane triacrylate, 0.1 parts of 2,5-dimethyl 2,5-bis(tert-butylperoxy)hexane, 0.1 parts of 2-hydroxy-4-methoxydi Benzophenone, 0.2 parts of aminopropyltrimethoxysilane, 0.1 parts of bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate.

[0047] Adhesive layer...

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Abstract

The invention discloses a multi-layer composite photovoltaic packaging adhesive film resistant to PID (potential induced degradation) as well as a preparation method and an application. The multi-layer composite photovoltaic packaging adhesive film is formed by sequentially composing multiple bonding layers and barrier layers at intervals, and the multi-layer composite photovoltaic packaging adhesive film comprises 2-5 layers in total and comprises 1-3 barrier layers. The barrier layers are arranged in the multi-layer composite photovoltaic packaging adhesive film, a formula of the barrier layers is optimized and designed, and the PID resistance of the photovoltaic packaging adhesive film can be improved. A charge dissipation agent is added to the barrier layers to absorb and eliminate charges enriched on surfaces of battery pieces, so that charges are quenched, and the PID resistance of the adhesive film is enhanced; a matrix material of the barrier layers has higher volume resistivity and lower water vapor transmittance and achieves the water and oxygen barrier purpose.

Description

technical field [0001] The invention belongs to the field of packaging adhesive films for photovoltaic modules, in particular to a multi-layer composite photovoltaic packaging adhesive film resistant to potential induced degradation (Potential Induced Degradation, PID) and a preparation method thereof, which are mainly used in the packaging of photovoltaic modules. Background technique [0002] The long-term reliable and stable operation of crystalline silicon solar cell modules faces a serious challenge, namely the potential-induced degradation (PID) effect. Potential-induced attenuation phenomenon is that under the action of bias voltage for a long time, a leakage current is formed between the glass, packaging material, cell, and frame, which causes a large amount of charge to accumulate on the surface of the cell, which makes the passivation effect of the cell surface worse, and eventually It leads to the decrease of FF, Isc, and Voc, and in severe cases, the power of the...

Claims

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Application Information

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IPC IPC(8): C09J7/24C09J7/29C09J4/06C09J4/02C09J11/06H01L31/048
CPCC09J4/06C09J11/06C09J2203/326C09J2203/33C09J2423/046C09J2423/106C09J2433/006C09J2451/006C09J7/243C09J7/29H01L31/0481Y02E10/50
Inventor 魏梦娟周光大侯宏兵桑燕林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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