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Flame-retardant type high temperature-resistant polyimide composite plate and application thereof

A technology of polyimide board and polyimide, which is applied in the field of polymers, can solve the problems of reducing the heat resistance of polyimide, reducing the mechanical properties of polyimide, and the poor flame retardancy of polyimide materials. , to achieve the effects of improving flame retardancy and heat resistance, promoting the char formation process, and increasing compatibility

Inactive Publication Date: 2019-02-12
SUZHOU KAIMULE INSULATED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat resistance has a lot to do with the rigid groups in the molecular structure, but due to the commonality of organic matter, the flame retardancy of polyimide materials is poor
The existing technology generally improves the flame retardancy of polyimide by adding flame-retardant fillers or flame-retardant small molecules, and there are obvious problems, such as fillers significantly reducing the mechanical properties of polyimide, small molecules will greatly reduce Amine heat resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for preparing a flame-retardant and high-temperature-resistant polyimide composite board, comprising the following steps:

[0024] (1) Mix aluminum phosphate, talcum powder and yttrium oxide evenly, sinter at 900°C for 55 minutes, and then pulverize into a powder with an average particle size of 150 nanometers; disperse the powder in ethanol, add isotridecyl alcohol polyoxyethylene Ether, reflux and stir for 35 minutes, then add 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, stir for 15 minutes, and finally dry to obtain the filler; bisphenol A type cyanate Add the monomer into the reactor, react at 95°C for 5 minutes, add methyl p-hydroxybenzoate, lanthanum trifluoromethanesulfonate, raise the temperature to 135°C, then add nonylphenol polyoxyethylene ether, m-aminoacetanilide and titanium Zinc acid, add filler after reacting for 50 minutes, and stir for 2 hours to prepare cyanate prepolymer; powder, ethanol, isomeric tridecanol polyoxyethylene ether, 2,5-dimet...

Embodiment 2

[0029] A method for preparing a flame-retardant and high-temperature-resistant polyimide composite board, comprising the following steps:

[0030] (1) Mix aluminum phosphate, talcum powder and yttrium oxide evenly, then sinter at 900°C for 75 minutes, and then pulverize into a powder with an average particle size of 150 nm; disperse the powder in ethanol, add isotridecyl alcohol polyoxyethylene Ether, reflux and stir for 25 minutes, then add 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, stir for 15 minutes, and finally dry to obtain the filler; bisphenol A cyanate Add the monomer into the reactor, react at 95°C for 8 minutes, add methyl p-hydroxybenzoate and lanthanum trifluoromethanesulfonate, raise the temperature to 130°C, then add nonylphenol polyoxyethylene ether, m-aminoacetanilide and titanium Zinc acid, add filler after reacting for 50 minutes, and stir for 2 hours to prepare cyanate prepolymer; powder, ethanol, isomeric tridecanol polyoxyethylene ether, 2,5-dimethyl-2...

Embodiment 3

[0035] A method for preparing a flame-retardant and high-temperature-resistant polyimide composite board, comprising the following steps:

[0036] (1) Mix aluminum phosphate, talcum powder and yttrium oxide evenly, sinter at 900°C for 55 minutes, and then pulverize into a powder with an average particle size of 150 nanometers; disperse the powder in ethanol, add isotridecyl alcohol polyoxyethylene Ether, reflux and stir for 25 minutes, then add 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, stir for 15 minutes, and finally dry to obtain the filler; bisphenol A cyanate Add the monomer into the reactor, react at 90°C for 8 minutes, add methyl p-hydroxybenzoate and lanthanum trifluoromethanesulfonate, raise the temperature to 135°C, then add nonylphenol polyoxyethylene ether, m-aminoacetanilide and titanium Zinc acid, add filler after reacting for 50 minutes, and stir for 2 hours to prepare cyanate prepolymer; powder, ethanol, isomeric tridecanol polyoxyethylene ether, 2,5-dimethy...

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Abstract

The invention discloses a flame-retardant type high temperature-resistant polyimide composite plate and application thereof. The flame-retardant type high temperature-resistant polyimide composite plate is prepared by the following steps of soaking the polyimide plate into a coating slurry, fetching out after 3 to 5 min, heating for 5 to 8 min at the temperature of 90 DEG C, soaking into the coating slurry again, fetching out after 8 to 12 min, and heating for 10 to 15 min at the temperature of 110 DEG C; finally, treating for 40 to 55 min at the temperature of 155 DEG C under the vacuum condition, so as to obtain the flame-retardant type high temperature-resistant polyimide composite plate; the thickness of the polyimide plate is equal to 92 to 95% of the thickness of the flame-retardanttype high temperature-resistant polyimide composite plate; proved by testing, the glass transition temperature of the prepared flame-retardant type high temperature-resistant polyimide composite plateis 302 DEG C, the initial thermal weight loss temperature is 406 DEG C, the oxygen index is 45, the residual rate at the temperature of 700 DEG C is 37%, the bending strength is 62 MPa, the knife isnot stuck in edge fetching, and the knife is not replaced within the 500 m range.

Description

[0001] This application is a divisional application of the invention titled a flame-retardant and high-temperature-resistant polyimide composite board and its preparation method, the application date is August 2, 2016, and the application number is 2016106232251, which belongs to the product and application technology part . technical field [0002] The invention belongs to the technical field of polymers, and in particular relates to a flame-retardant and high-temperature-resistant polyimide composite board and its application. Background technique [0003] As a high heat-resistant resin, polyimide is widely used in various fields. The heat resistance has a lot to do with the rigid groups in the molecular structure, but due to the commonality of organic matter, the flame retardancy of polyimide materials is poor. The existing technology generally improves the flame retardancy of polyimide by adding flame-retardant fillers or flame-retardant small molecules, and there are o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C09D4/02C09D4/06C09D7/63C09D5/18C08G73/10C08K9/04C08K3/32C08K3/34C08K3/22
CPCC08G73/1057C08G73/106C08G73/1071C08J7/04C08J7/042C08J2379/08C08K3/22C08K3/32C08K3/34C08K9/04C08K9/08C08K2003/221C08K2003/327C08K2201/003C08K2201/011C09D4/06C09D5/18C09D7/63
Inventor 陈亮赵广昊钟华春唐柏青程爱民赵继辉许建军刘晓恒赵继英
Owner SUZHOU KAIMULE INSULATED MATERIALS CO LTD
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