Method for activating carbon fiber by colloid copper and preparing chemical plating copper-nickel duplex metal layer by one-step

Abstract

The invention discloses a method for activating a carbon fiber by colloid copper and preparing a chemical plating copper-nickel duplex metal layer by one-step. According to the method for activating the carbon fiber by the colloid copper and preparing the chemical plating copper-nickel duplex metal layer by one-step, a colloid copper activating method is adopted to replace traditional palladium, cheap material copper sulfate is adopted, an optimized activating solution has good stability and high activation properties, and a composite plate formed during subsequent chemical plating is even andcontinuous; in addition, compared with a two-step method of nickel plating after copper plating, a one-step method of chemically plating the copper-nickel duplex metal layer reduces the using amountof copper sulfate and nickel sulfate, and the one-step method is faster and more efficient; and sodium monophosphate is used for replacing formaldehyde as a reducing agent, and environmental pollutionand harm to human bodies are reduced.

Description

technical field [0001] The invention belongs to the field of composite materials, and relates to a method for activating carbon fibers with colloidal copper and preparing an electroless copper-nickel double metal layer in one step. Background technique [0002] Carbon fiber (carbon fiber, referred to as Cf) is a special fiber composed of carbon elements. With the advantages of good compatibility with other materials, good flexibility, and strong designability, it is often selected as an ideal composite material reinforcement and widely used in the preparation of composite materials. Carbon fiber reinforced aluminum matrix composites combine the excellent properties of carbon fiber reinforced phase and aluminum matrix, and have many advantages such as oxidation resistance, high temperature resistance, radiation resistance and flame resistance, no moisture absorption, no degassing, no aging, good electrical and thermal conductivity, etc. , becoming one of the most promising c...

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Problems solved by technology

[0005] Zhang Ning uses the traditional metal palladium activation method (metal palladium activation is to form a layer of discontinuous noble metal particles on the surface of the substrate, so that the surface of the substrate has the ability of catalytic reduction, so that the electroless plating reaction can proceed smoothly on the surface of the substrate) to activate the carbon fiber. Treatment, the price of metal palladium is expensive, the cost of medicine is high, and the waste liquid is easy to cause environmental pollution; Lai Xinghua uses the traditional colloidal copper activation method to activate ABS plastic. The traditional colloidal copper activation solution has poor stability and weak activation. There is a phenomenon of missed plating during post-electroless plating and it is difficult to form a continuous and uniform metal coating, and after the traditional colloidal copper activation treatment, only a single metal layer can be electroless plated

[0006] In summary, in the current technology, there are many deficiencies in the metal palladium activation method, such as the large amount of metal palladium and the high price of palladium, and the waste liquid seriously pollutes the environment; the traditional colloidal copper activation solution has poor stability, weak activation, and chemical There are deficiencies such as missed plating during plating and it is difficult to form a continuous and uniform metal coating; and the current two-step electroless plating composite coating uses a lot of raw materials and cumbersome steps.

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