Single-component boiled adhesive easy to boil and degum and preparation method thereof

A one-component, degumming technology, used in chemical instruments and methods, adhesives, adhesive types, etc., can solve the problems of long boiling degumming time and low bonding strength, to ensure stability and efficient bonding ability. , The effect of high bonding strength

Inactive Publication Date: 2019-01-18
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of diamond wire cutting the workpiece plate, the resin plate is used as an auxiliary material, and it needs to be bonded and fixed with the workpiece plate with boiled glue before it can be used. The traditionally used boiled glue has the disadvantages of low bonding strength and long boiled degumming time. There is a need for a boiled glue with high bonding strength that can be boiled and degummed quickly, so that the resin plate and the workpiece plate have a good bonding effect before cutting, and the resin plate and the workpiece plate can be quickly boiled and degummed after cutting, so that they can be recycled intact workpiece plate

Method used

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  • Single-component boiled adhesive easy to boil and degum and preparation method thereof
  • Single-component boiled adhesive easy to boil and degum and preparation method thereof
  • Single-component boiled adhesive easy to boil and degum and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The preparation components of the one-component boiled glue include: 46 parts by mass of hydroxypropyl methacrylate, 25 parts by mass of urethane acrylate, 4 parts by mass of hydrophilic monomer, 4 parts by mass of hydrophilic resin, 1 part by mass of accelerator, 1 part by mass of peroxide initiator, 1 part by mass of anti-settling agent, and 6 parts by mass of foaming agent. The hydrophilic monomer is polyethylene glycol methacrylate, and the hydrophilic resin is a polyacrylic resin.

[0028] The preparation method of one-component boiled glue that is easy to boil and degummed includes the following steps:

[0029] Step 1. Weigh hydroxyethyl methacrylate and urethane acrylate in parts by mass and add them to the reactor 4, stir evenly to obtain a mixed solution;

[0030] Step 2: Add the hydrophilic monomer and the hydrophilic resin to the mixed solution in order by mass parts and stir until uniform, the accelerator is stirred until uniform, the initiator is stirred until un...

Embodiment 2

[0032] The preparation components of the one-component boiled glue include: 50 parts by mass of hydroxypropyl methacrylate, 30 parts by mass of urethane acrylate, 6 parts by mass of hydrophilic monomer, 8 parts by mass of hydrophilic resin, 2 parts by mass of accelerator, 2 parts by mass of peroxide initiator, 1 part by mass of anti-settling agent, and 10 parts by mass of foaming agent.

[0033] The hydrophilic monomer is polyethylene glycol methacrylate, and the hydrophilic resin is a polyacrylic resin.

[0034] The preparation method of one-component boiled glue that is easy to boil and degummed includes the following steps:

[0035] Step 1. Weigh hydroxyethyl methacrylate and urethane acrylate in parts by mass and add them to the reactor 4, stir evenly to obtain a mixed solution;

[0036] Step 2: Add the hydrophilic monomer and the hydrophilic resin to the mixed solution in order by mass parts and stir until uniform, the accelerator is stirred until uniform, the initiator is stirre...

Embodiment 3

[0038] The preparation components of the one-component boiled glue include: 48 parts by mass of hydroxypropyl methacrylate, 28 parts by mass of urethane acrylate, 5 parts by mass of hydrophilic monomer, 6 parts by mass of hydrophilic resin, 1.5 parts by mass of accelerator, 1.5 parts by mass of peroxide initiator, 1 part by mass of anti-settling agent, and 8 parts by mass of foaming agent.

[0039] The hydrophilic monomer is polyethylene glycol methacrylate, and the hydrophilic resin is a polyacrylic resin.

[0040] The preparation method of one-component boiled glue that is easy to boil and degummed includes the following steps:

[0041] Step 1. Weigh hydroxyethyl methacrylate and urethane acrylate in parts by mass and add them to the reactor 4, stir evenly to obtain a mixed solution;

[0042] Step 2: Add the hydrophilic monomer and the hydrophilic resin to the mixed solution in order by mass parts and stir until uniform, the accelerator is stirred until uniform, the initiator is sti...

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Abstract

The invention discloses a single-component boiled adhesive easy to boil and degum and a preparation method thereof. The preparation method specifically comprises the following steps: weighing, in parts by mass, 46-50 parts of hydroxyethyl methylacrylate and 25-30 parts of urethane acrylate, adding into a reaction kettle, and uniformly stirring to obtain mixed liquid; sequentially adding 4-6 partsof a hydrophilic monomer and 4-8 parts of hydrophilic resin into the mixed liquid and uniformly stirring, adding 1-2 parts of an accelerant and uniformly stirring, adding 1-2 parts of an initiator anduniformly stirring, adding 1 part of an anti-settling agent and uniformly stirring, adding 6-10 parts of a foaming agent and uniformly stirring, stopping stirring to obtain the single-component boiled adhesive. By adopting the single-component boiled adhesive disclosed by the invention, a resin plate and a workpiece plate can be solidly bonded, the resin plate and the workpiece plate can be rapidly separated through rapid water boiling and degumming after being cut, and the single-component boiled adhesive has the benefit that the recovery of an intact workpiece plate is facilitated.

Description

Technical field [0001] The invention relates to the field of glue. More specifically, the present invention relates to a one-component boiled glue that is easy to boil and degummed and a preparation method thereof. Background technique [0002] In the process of cutting the workpiece board by the diamond wire, the resin board is used as an auxiliary material, which needs to be bonded and fixed with the workpiece board with boiled glue. The traditionally used boiled glue has the disadvantages of low bonding strength and long boiling time for degumming. There is a need for a boiled glue with high bonding strength and quick boiling and degumming, so that the resin board and the workpiece board before cutting have a good bonding effect, and the resin board and the workpiece board can be quickly boiled and degummed after cutting, so that the recovery is intact Workpiece plate. Summary of the invention [0003] An object of the present invention is to solve at least the above-mentione...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/04C09J11/06C09J11/08B01J19/00B01J19/18
CPCB01J19/0066B01J19/18C08L2205/035C09J11/04C09J11/06C09J11/08C09J175/14C08L33/04C08L71/02C08L93/00C08K13/02C08K3/36C08K5/00
Inventor 陆钟世苏光临陈韬潘方立黄福旦潘永强
Owner 广西珀源新材料有限公司
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