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Alloy, lead-free solder material, preparation method and application thereof

A technology of lead-free solder and metal materials, applied in the direction of welding/cutting media/materials, welding equipment, metal processing equipment, etc., can solve the problems of glass parts cracking, glass breaking stress, etc., achieve good welding adhesion and reduce process The effect of requesting and guaranteeing strength

Active Publication Date: 2019-12-27
吉卫
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the welding of glass parts, due to the special properties of glass, the welding will be embedded in the glass during the conventional welding process, which will destroy the stress of the glass and cause the glass parts to easily crack

Method used

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  • Alloy, lead-free solder material, preparation method and application thereof

Examples

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preparation example Construction

[0037] The present invention also provides a method for preparing a lead-free solder material, the method comprising: melting and molding a metal material to obtain a lead-free solder material, wherein the metal material includes 40-95% by weight of indium, 3-5% by weight silver, 0.2-1 wt% copper and 0.5-55 wt% tin, and unavoidable impurities.

[0038] Preferably, the metal material includes 60-95% by weight of indium, 3-5% by weight of silver, 0.2-1% by weight of copper, and 0.5-35% by weight of tin, as well as unavoidable impurities. More preferably, the metal material includes 60-80% by weight of indium, 3.5-4.5% by weight of silver, 0.4-0.6% by weight of copper, and 15-35% by weight of tin, as well as unavoidable impurities.

[0039] Preferably, the metal material includes 80-95% by weight of indium, 3.5-4.5% by weight of silver, 0.5-1% by weight of copper, and 0.5-15% by weight of tin, as well as unavoidable impurities. More preferably, the alloy of the metal material in...

preparation example

[0057] This preparation example is used to illustrate the preparation of solder wire.

[0058] (1) according to formula proportion shown in table 1, allocate metal material;

[0059] (2) Melt the metal material at 130°C for 0.5h and mix it. After mixing, use a multi-element analyzer to detect the ratio of each element. If the requirements are not met, you need to fine-tune the ratio by adding a small amount of metal material and melting and mixing again;

[0060] (3) casting the molten mixed metal material into a cylindrical shape with a diameter of 10mm under molten mixing conditions;

[0061] (4) Use a die-casting machine to perform die-casting at room temperature, and obtain materials with a diameter of 10mm-8mm-6mm in sequence through die-casting, and then use a wire drawing machine to draw a solder wire with a diameter of 5mm.

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Abstract

The invention relates to the field of welding material, and discloses an alloy used as lead-free solder material, a lead-free solder material, preparation method and application thereof. The alloy used as the lead-free solder material comprises 40-95% by weight of indium, 3-5% by weight of silver, 0.2-1% by weight of copper and 0.5-55% by weight of tin, and unavoidable impurities. The lead-free solder material of the preparation method can provide good weld bonding force and does not affect the physical characteristics of the welding carrier itself.

Description

Technical field [0001] The invention relates to the field of soldering materials, and specifically relates to an alloy, a lead-free soldering material and a preparation method and application thereof. Background technique [0002] As an important industrial raw material, solder is widely used in the electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life. The main component of traditional solder used in relevant application fields in the industry is tin-lead, which does not meet the lead-free requirements of environmental regulations. Lead-containing tin slag not only causes pollution, but also damages the bone marrow, hematopoietic system, nervous system and kidneys after entering the human body. Lead-free is the development direction of soldering. [0003] Regarding the welding of glass parts, due to the special properties of glass, the welding will be embedded in the glass during the conventional welding process, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C13/00C22C28/00C22C1/02B23K35/26
CPCB23K35/26C22C1/02C22C13/00C22C28/00
Inventor 吉卫
Owner 吉卫
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