Cordierite-based microcrystalline glass material and preparation method thereof

Abstract

Belonging to the field of electronic ceramic materials, the invention provides a cordierite-based microcrystalline glass material and a preparation method thereof, and overcomes the problem of poor matching with silicon chips caused by large thermal expansion coefficient, low flexural strength, high dielectric constant, high dielectric loss and the like of existing ceramic materials. The cordierite-based microcrystalline glass material provided by the invention belongs to a magnesium-aluminum-silicon system, the principal crystalline phase is cordierite, the density is high, the flexural strength is up to 230MPa, the Young's modulus is 80-100GPa high, the thermal stability is good, the thermal expansion coefficient is 1.5-2.5*10<-6> / DEG C (20-600DEG C) low, and the cordierite-based microcrystalline glass material can form good match with silicon chips. At the same time, the dielectric constant can be adjusted to 4.5-5.0, the dielectric loss is tan Delta is less than 0.6*10<-3>, the signal transmission speed is greatly improved, and the power consumption is greatly reduced. In addition, in the preparation process, the temperature is lowered from the 1100DEG C or above in the traditional sintering process to 900DEG C or below, under the premise of improving the performance, the sintering temperature is further reduced and the production cost is saved. Moreover, the whole preparation technology has the characteristics of simple process, abundant raw material sources and energy consumption reduction, thus being of important significance for industrial production.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a cordierite-based low-thermal-expansion glass-ceramic material and a preparation method thereof; the material is suitable for electronic packaging, especially for ultra-large-scale integrated circuits. Background technique [0002] The rapid development of information technology promotes the continuous development of integrated circuit systems towards high density, ultra-large scale and multi-functionalization. The rapid improvement of semiconductor chip performance also makes electronic packaging technology develop towards more advanced high-density and three-dimensional packaging. , which puts forward higher requirements for electronic packaging substrate materials, especially the need to have sufficiently high flexural strength and excellent dielectric properties, and the thermal expansion coefficient needs to match the substrate and chip. Electronic ceramic material...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a cordierite-based low-thermal-expansion A glass-ceramic material and a preparation method thereof, and an electronic packaging substrate made of the material can not only achieve good thermal matching with a silicon chip, but also have high bending strength, good dielectric properties, simple production process, high stability, low cost

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