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Preparation method of high-bonding type copper-based electrical contact material

A technology of electrical contact materials and bonding, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of poor performance of electrical contact materials and low bonding strength, and achieve improved bonding properties, improving structural characteristics, improving the effect of mechanical strength and mechanical properties

Inactive Publication Date: 2018-11-30
FOSHAN TENGLI NEW ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention: Aiming at the problem that the bonding strength of the existing alloy electrical contact material is not high, resulting in poor performance of the material electrical contact material, a preparation method of a high-bonding copper-based electrical contact material is provided

Method used

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  • Preparation method of high-bonding type copper-based electrical contact material

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example 1

[0018] In parts by weight, weigh 90 parts of deionized water, 3 parts of peach gum, 1 part of silver nitrate and 3 parts of trisodium citrate in a beaker, stir and mix them and place them under ultraviolet light for 3 hours, stir and mix And collect the mixed sol solution; then weigh 45 parts of deionized water, 2 parts of aluminum nitrate, and 3 parts of lactic acid respectively in a beaker according to parts by weight, mix and place at room temperature to stir and react for 6 hours, collect the mixed solution and place In a rotary evaporator, evaporate at 75°C to 1 / 5 of the original volume, collect the rotary sol and mix it with a volume ratio of 1:1, stir and mix the mixed sol and the rotary sol and place it under 200W for ultrasonic dispersion 10min, collect the dispersion sol; by weight, weigh 45 parts of copper powder, 10 parts of dispersion sol and 1 part of lanthanum respectively and place them in a ball mill tank, collect the ball mill slurry after ball milling at room...

example 2

[0020] In parts by weight, weigh 95 parts of deionized water, 4 parts of peach gum, 2 parts of silver nitrate and 4 parts of trisodium citrate in a beaker, stir and mix them and place them under ultraviolet light for 2 hours, stir and mix And collect the mixed sol solution; then weigh 47 parts of deionized water, 2 parts of aluminum nitrate, and 4 parts of lactic acid in a beaker according to parts by weight, mix and place it at room temperature for stirring and reacting for 7 hours, collect the mixed solution and place In a rotary evaporator, evaporate at 80°C to 1 / 5 of the original volume, collect the rotary sol and mix it with a volume ratio of 1:1, stir and mix the mixed sol and the rotary sol and place it under 250W for ultrasonic dispersion 12min, collect the dispersion sol; weigh 47 parts of copper powder, 12 parts of dispersion sol and 2 parts of lanthanum respectively in the ball mill tank, collect the ball mill slurry after ball milling at room temperature for 4 hours...

example 3

[0022] In parts by weight, weigh 100 parts of deionized water, 5 parts of peach gum, 2 parts of silver nitrate and 5 parts of trisodium citrate in a beaker, stir and mix them and place them under ultraviolet light for 5 hours, stir and mix And collect the mixed sol solution; then weigh 50 parts of deionized water, 3 parts of aluminum nitrate, and 5 parts of lactic acid in a beaker, mix them and place them at room temperature for 8 hours, collect the mixed solution and place In a rotary evaporator, evaporate at 85°C to 1 / 5 of the original volume, collect the rotary sol and mix it with a volume ratio of 1:1, stir and mix the mixed sol and the rotary sol and place it under 300W for ultrasonic dispersion 15min, collect the dispersed sol; weigh 50 parts of copper powder, 15 parts of dispersed sol and 2 parts of lanthanum respectively in the ball mill tank, collect the ball mill slurry after ball milling at room temperature for 5 hours, and pour the ball mill slurry Put the mold int...

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Abstract

The invention relates to a preparation method of high-bonding type copper-based electrical contact material, and belongs to the technical field of electrical contact materials. The preparation methodis characterized in that nano-silver sol and alumina sol is compounded to perform organic bonding and perform mechanical bonding through ball milling medium, the sol and the metal copper material aresubjected to effective ball milling compound and fused, and reduced by hydrogen gas so as to be filled and effectively coated to the surface of the cooper-based material, thus the effective bonding isformed, the bonding performance of the electrical contact material is improved; the preparation method is characterized in that the compound ball milling reaction of the sol and copper powder, the copper powder is used as an anchor point to form effective anchoring effect in the material, at the same time, the sol-material is crosslinked with each other to form a three-dimensional network of cross-linked structure, mechanical strength and mechanical properties of the materials are improved effectively by improving the structural characteristics of the materials.

Description

technical field [0001] The invention relates to a preparation method of a high-bonding copper-based electrical contact material, which belongs to the technical field of electrical contact materials. Background technique [0002] At present, the most widely used electrical contact materials for low-voltage electrical appliances are silver-based materials, mainly including Ag-MeO, Ag-C, Ag-Ni, and Ag-W. Among them, the Ag-CdO material with the best comprehensive performance will be decomposed under high-temperature electric arc, and its Cd will be sublimated into highly toxic Cd vapor, which poses a threat to human health and the environment. Therefore, its application is greatly limited. At the same time, silver resources are scarce and cannot be recycled, so it is urgent to develop silver-saving and environmentally friendly electrical contact materials. Because copper has mechanical properties and electrical properties close to silver, researchers have devoted themselves t...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C9/00H01B1/16H01B13/00
CPCC22C1/05C22C9/00H01B1/16H01B13/00
Inventor 刘菊花韩桂林
Owner FOSHAN TENGLI NEW ENERGY TECH CO LTD
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