Curable resin composition and fan out type wafer level package

A technology of curable resin and curable components, applied in the direction of electric solid devices, semiconductor/solid device parts, circuits, etc., to achieve the effect of reducing warpage and high quality and reliability

Active Publication Date: 2018-10-23
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is not necessarily easy to directly mount a semiconductor chip with bumps formed at a fine pitch on a circuit board.

Method used

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  • Curable resin composition and fan out type wafer level package
  • Curable resin composition and fan out type wafer level package
  • Curable resin composition and fan out type wafer level package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0213] Hereinafter, the present invention will be described by way of examples, but the present invention is not limited by these examples. In addition, unless otherwise stated, "part" and "%" mean a mass part.

[0214]

[0215] 119.4 parts of novolak-type cresol resin (manufactured by Showa Denko, Shonol CRG951, OH equivalent: 119.4) and 1.19 parts of potassium hydroxide were charged into an autoclave equipped with a thermometer, a nitrogen introduction device and an alkylene oxide introduction device, and a stirring device and 119.4 parts of toluene, nitrogen substitution was carried out in the system under stirring, and the temperature was raised by heating. Next, slowly add 63.8 parts of propylene oxide dropwise at 125°C to 132°C at a rate of 0 to 4.8kg / cm 2 React for 16 hours. After cooling to room temperature, 1.56 parts of 89% phosphoric acid was added and mixed to the reaction solution, and potassium hydroxide was neutralized to obtain a non-volatile component of 6...

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Abstract

Provided are the following: a curable resin composition able to suppress the degree of warping at temperatures that occur when mounting semiconductor wafers and semiconductor packages, and especiallyfan out type wafer level packages (FO-WLP), and at room temperature during wafer transport and the like; and a fan out type wafer level package provided with a warpage correction layer comprising a cured product of the curable resin composition. The curable resin composition can be cured by means of at least 2 types of curing reaction and contains a curable component (A1) whose volume shrinks whenone of the curing reactions is carried out and a curable component (B1) whose volume shrinks when another curing reaction is carried out.

Description

technical field [0001] The present invention relates to a curable resin composition, and more specifically, to a curable resin composition capable of suppressing warping of a semiconductor chip or a semiconductor package; in particular, to a fan in which an electrode for external connection is arranged in an area larger than the planar size of the semiconductor. A curable resin composition for forming a warpage correction layer on a surface opposite to a rewiring layer in a fan-out type wafer level package. Background technique [0002] In recent years, the demand for miniaturization in the field of semiconductor circuits and the like has gradually increased. To meet this demand, semiconductor circuits may be mounted in packages (Chip Size Packages) close to their chip size. As one of means for realizing chip-scale packaging, a packaging method called wafer-level packaging (Wafer Level Package, hereinafter sometimes abbreviated as WLP) in which wafer-level bonding and fragme...

Claims

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Application Information

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IPC IPC(8): H01L23/12C08L101/00H01L23/00
CPCC08L101/00H01L23/00H01L23/12H01L2924/37001H01L2224/12105H01L2224/96H01L2224/97H01L2924/10253H01L2924/10329H01L2924/14H01L2924/3511C08J3/243C08J3/244C08L63/00H01L23/293
Inventor 舟越千弘佐藤和也伊藤信人
Owner TAIYO INK MFG
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