Composition capable of crosslinking hydrocarbon polymer and prepared prepreg and thermosetting copper clad plate

Abstract

The invention belongs to the field of communication materials and particularly relates to a composition capable of crosslinking a hydrocarbon polymer and a prepared prepreg and a thermosetting copperclad plate, the dielectric property of the composition is excellent, the mechanical strength is high, the glass transition temperature and the heat resistance are high, the coefficient of thermal expansion is low, the peel strength of copper foil is high, the evenness of the various performances is high, the composition is suitable for manufacturing a multi-layer copper clad plate, and the variousperformance requirements on function diversification and complication of the copper clad plate material are met in the high-frequency high-speed communication field. Therefore, the composition has anexcellent basis for industrial production and a broad application prospect.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a crosslinkable hydrocarbon polymer composition and a prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones and intelligent robots, and are one of the key materials in the electronic communication and information industries. Traditional thermosetting resins represented by epoxy resin, phenolic resin and cyanate resin have high thermo-mechanical properties, low thermal expansion coefficient, high quality and low price, convenient processing and strong versatility. They are commonly used in the production of copper clad laminate substrates. Material. After continuously exploring and optimizing the formula and process parameters, researchers have prepared various types o...

AI Technical Summary

Problems solved by technology

However, in addition to polystyrene, polyphenylene ether generally has poor compatibility with other resins, resulting in serious phase separation of the resin in the prepreg composite matrix, and the bonding between the matrix resin and fillers and fiber cloth and other reinforcing materials Poor strength

The thermal-mechanical stability of the copper-clad laminate prepared in this way is average, and the dielectric properties and thermal expansion coefficient uniformity of different parts are poor. Diversified and complex functions of copper plate materials, high-density circuit layout and other requirements

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