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Metamaterial based on liquid metal microfluidics and preparation method thereof

A liquid metal and metamaterial technology, applied in electrical components, antennas, etc., can solve problems such as structural shape and material properties that cannot be dynamically adjusted, and achieve the effects of improving application performance, optimizing structure, and expanding the scope of application

Active Publication Date: 2018-08-07
BEIJING MECHANICAL EQUIP INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above analysis, the embodiment of the present invention aims to provide a liquid metal microfluidic-based metamaterial and its preparation method to solve the problem that the structural shape and material properties of the existing metamaterial cannot be dynamically adjusted after the design and processing are completed.

Method used

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  • Metamaterial based on liquid metal microfluidics and preparation method thereof
  • Metamaterial based on liquid metal microfluidics and preparation method thereof
  • Metamaterial based on liquid metal microfluidics and preparation method thereof

Examples

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Embodiment 1

[0051] Such as figure 1 As shown, a specific embodiment of the present invention discloses a metamaterial based on liquid metal microfluidics, which includes a bottom metal layer, an intermediate dielectric layer and a microchannel array arranged on the surface of the intermediate dielectric layer.

[0052] The bottom metal layer and the intermediate dielectric layer are fixed film layers. The intermediate dielectric layer includes a dielectric material for isolation.

[0053] Optionally, the bottom metal layer can be selected from metal thin film materials such as silver and copper, and the intermediate dielectric layer can be selected from at least one of silicon dioxide, silicon, aluminum oxide, silicon rubber, and polydimethylsiloxane (PDMS) Species, or other materials suitable for the metamaterial intermediate layer.

[0054] Liquid metal is arranged in the microchannel, and the liquid metal flows in the microchannel to form a metal microstructure on the surface of the metamate...

Embodiment 2

[0059] Such as figure 2 As shown, optimized on the basis of the above embodiment, the liquid metal uses gallium or gallium alloy, such as gallium indium alloy, gallium indium tin alloy, and is driven by external force to realize the flow in the microstructure and form the metal of the metamaterial surface layer. microstructure. Through the arbitrary fluidity of liquid gallium or gallium alloy, microfluidization of liquid gallium or gallium alloy can realize micro-flow control of metamaterials. The technology is applied to the reconstruction of the structural parameters and structural morphology of metamaterials, which have the ability to regulate their physical properties.

[0060] In an air environment, liquid metal easily interacts with air to form an oxide layer on the surface of the liquid metal. The thickness of the oxide layer is 3-5nm, which should be removed during processing. Before injecting liquid metal into the microchannel structure, the channel structure should be...

preparation Embodiment 2

[0069] A method for preparing the metamaterial described in Example 2 specifically includes the following steps:

[0070] 1. Prepare the bottom metal layer and the intermediate dielectric layer by magnetron sputtering process or chemical vapor deposition method. The bottom metal layer is made of metal thin film materials such as silver or copper, and the intermediate dielectric layer is made of silicon dioxide, silicon, and aluminum oxide silicon. At least one of rubber, PDMS and other materials;

[0071] 2. Micro-channel arrays are prepared by micro-nano processing technology, which includes photolithography, nano-imprinting, etc., and each micro-channel is prepared by any of screen printing, coating, magnetron sputtering, PECVD, etc. The base

[0072] 3. Use a vacuum oven to cure PDMS at a temperature of 70-100°C to prepare a package cover, and then use high temperature and plasma technology to seal the package cover and the intermediate dielectric layer;

[0073] 4. Dry the prepar...

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Abstract

The invention relates to a metamaterial based on liquid metal microfluidics, and belongs to the technical field of electromagnetic communication. The metamaterial solves the problem that the structureform and the material attribute cannot be dynamically adjusted after the existing metamaterial is designed and processed. The metamaterial comprises a bottom metal layer, a middle medium layer and amicrochannel array, wherein the microchannel array is arranged at the surface of the middle medium layer; the bottom metal layer and the middle medium layer are fixed film layers; liquid metal is arranged in a microchannel, and flows in the microchannel; a metal micro-structure is formed at the surface layer of the metamaterial. The metamaterial has the advantages that the liquid metal is driven by external force to flow in the microchannel, the length or width size of the metal micro-structure is adjusted, and the physical attributes of the metamaterial are changed; the application range is widened, and the practical application property is greatly improved.

Description

Technical field [0001] The present invention relates to the technical field of electromagnetic communication, and in particular to a metamaterial based on liquid metal microfluidics and a preparation method thereof. Background technique [0002] As a new type of artificial composite microstructure, metamaterials have extraordinary physical properties that natural materials do not have. Because its structure can be artificially designed, metamaterials can control material properties, leading to rapid development and application in fields such as stealth technology, communication technology, and sensing technology. [0003] In recent years, with the rapid development of micro-nano preparation technology, metamaterials with micro-nano scale structures can be processed accurately, so the application fields and scope of metamaterials have become more and more extensive. Although metamaterials have very excellent properties, their equivalent dielectric constant, magnetic permeabi...

Claims

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Application Information

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IPC IPC(8): H01Q15/00H01Q17/00
CPCH01Q15/0086H01Q17/00
Inventor 李平许诺臧金良刘立滨
Owner BEIJING MECHANICAL EQUIP INST
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