Semiconductor package structure with pin sidewall tin climbing function and its manufacturing process

Abstract

The invention relates to a semiconductor packaging structure with a pin side wall tin climbing function, and a manufacturing process thereof. The semiconductor packaging structure comprises a base island and pins; the pin comprises a planar part and an arc-shaped part; the arc-shaped part is positioned on the outer side of the planar part; the convex surface of the arc-shaped part faces the outward lower side; a chip is arranged on the front surface of the base island; the chip is electrically connected with the pin through a metal bonding wire; the pins, the base island and the peripheral region of the chip are packaged with a plastic packaging material; and the outer surfaces of the planar part and the arc-shaped part are exposed from the plastic packaging material. The side edge tin-plating area of the pin can be enlarged effectively, and a condition that the residual air in the outer convex arc-shaped position of the pin cannot be discharged outwards can be avoided, thereby improving welding performance and welding reliability of the product.

Description

technical field [0001] The invention relates to a semiconductor packaging structure with the function of tin climbing on the side wall of a pin and a manufacturing process thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of modern technology, semiconductor packaging has been widely used. Its extensive applications in radar, remote control telemetry, aerospace, etc. put forward higher and higher requirements for its reliability. The failure caused by poor soldering of semiconductors has attracted more and more attention, because this failure is often fatal and irreversible. Therefore, it is very important to get a good soldering reliability in the semiconductor industry. The tin layer on the soldering surface of the semiconductor can make the soldering stronger, especially for automotive electronics. [0003] As we all know, QFN (Quad Flat No-lead Package, four-sided leadless flat package) and DFN (Duad...

AI Technical Summary

Problems solved by technology

[0009] However, this kind of packaging structure that forms L-shaped outer leads or C-shaped outer leads by cutting ribs also has the following defects when forming L-shaped outer leads or C-shaped outer leads: first, when performing outer When the pins are formed, the outer pins are bent toward the side of the plastic package, Figure 1G and Figure 1H The inner pin at A will be affected by the rebound force of the metal, which will cause the metal pin to have the stress of being pulled away from the plastic package downwards, and in the case of this downward force, it is easy to cause A. Delamination occurs between the upper surface of the inner pin and the lower surface of the molding compound

Images