Method for brazed connection of DD98M single-crystal high-temperature alloy by Pd-Si composite solder
A technology of DD98M and superalloy, applied in welding medium, welding equipment, metal processing equipment, etc., can solve the problems of complex cavity structure, difficult core direct casting, etc., achieve excellent performance, promote the improvement of manufacturing level, and stable performance Effect
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Embodiment 1
[0028] Example 1: Taking Pd-Si composite solder as an example to connect DD98M single crystal and DD98M single crystal at a brazing temperature of 1060°C and a temperature of 60 minutes, the specific implementation process is as follows:
[0029] 1) Soak the DD98M single crystal superalloy in alcohol and ultrasonically remove the oil stains, then use 400#, 600#, 1000#, 1500# sandpaper to polish the surface to be connected, and then polish until there is no obvious scratch on the surface to be connected;
[0030] 2) Select Pd foil with a thickness of 0.025mm and a purity of 99.9% and Si powder with a particle size of 600 mesh and a purity of 99.99% as solder, cut two pieces of Pd foil with the same shape as the surface to be connected, and weigh them with an analytical balance Si powder, control the mass ratio of Pd and Si in the solder to be 20:1;
[0031] 3) According to the order of DD98M-Pd-Si-Pd-DD98M, firstly paste a piece of Pd foil on the surface to be connected of DD98...
Embodiment 2
[0038] Example 2: Taking the use of Pd-Si composite solder as an example to connect DD98M single crystal and DD98M single crystal at a brazing temperature of 1060°C and heat preservation for 30 minutes, the specific implementation process is as follows:
[0039] 1) Soak the DD98M single crystal superalloy in alcohol and ultrasonically remove the oil stains, then use 400#, 600#, 1000#, 1500# sandpaper to polish the surface to be connected, and then polish until there is no obvious scratch on the surface to be connected;
[0040] 2) Select Pd foil with a thickness of 0.025mm and a purity of 99.9% and Si powder with a particle size of 600 mesh and a purity of 99.99% as solder, cut two pieces of Pd foil with the same shape as the surface to be connected, and weigh them with an analytical balance Si powder, control the mass ratio of Pd and Si in the solder to be 20:1;
[0041]3) According to the order of DD98M-Pd-Si-Pd-DD98M, firstly paste a piece of Pd foil on the surface to be co...
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