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Flexible bonding electroconductive adhesive and preparation method thereof

A conductive adhesive and flexible technology, applied in the field of conductive adhesive, can solve the problems of being unable to meet the needs of flexible conductive bonding of flexible electronic products, not being able to bend and curl, and not being flexible enough, so as to save baking energy and work for a long time , the effect of low curing temperature

Active Publication Date: 2018-06-08
SHENZHEN SILMAC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flexibility of electronic products puts forward flexible requirements for conductive connecting materials. Although the traditional epoxy resin-based conductive adhesive has many advantages, its flexibility is not good enough, it is easy to crack, let alone bend and curl, and cannot meet the requirements of flexibility. Demand for Flexible Conductive Bonding in Electronic Products

Method used

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  • Flexible bonding electroconductive adhesive and preparation method thereof
  • Flexible bonding electroconductive adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0022] This embodiment provides a flexible bonding conductive adhesive. The raw material components include: 9.8 parts of flexible amorphous polyester resin, 2.8 parts of alicyclic epoxy resin, 1.4 parts of pressure-sensitive acrylic resin, based on 0.2 parts of hexamethylene diisocyanate blocking curing agent, 0.3 parts of hexafluoroantimonate, 1.0 parts of epoxy silane coupling agent, 14.5 parts of diethylene glycol butyl ether acetate, and a large particle size of 6 to 12 μm 63 parts of silver powder, 7 parts of silver powder with a particle size of 0.5-3 μm in small flakes.

[0023] According to above-mentioned raw material, adopt the preparation method of flexible bonding conductive glue provided by the present invention, prepare flexible bonding conductive glue:

[0024] S1: Mix flexible polyester resin and diethylene glycol butyl ether acetate at a mass ratio of 1:1, then heat and stir at 80°C for 5 hours to disperse the resin completely to obtain a dispersion;

[0025...

Embodiment 2

[0030] This embodiment provides a flexible bonding conductive adhesive. The raw material components include: 9 parts of flexible amorphous polyester resin, 2.5 parts of alicyclic epoxy resin, 1.3 parts of pressure-sensitive acrylic resin, based on 0.15 parts of hexamethylene diisocyanate blocking curing agent, 0.2 parts of hexafluoroantimonate, 0.8 parts of epoxy silane coupling agent, 14 parts of diethylene glycol butyl ether acetate, a large particle size of 6 to 12 μm 54 parts of silver powder, 6 parts of small silver powder with a particle size of 0.5-3 μm.

[0031] According to above-mentioned raw material, adopt the preparation method of flexible bonding conductive glue provided by the present invention, prepare flexible bonding conductive glue:

[0032] S1: Mix flexible polyester resin and diethylene glycol butyl ether acetate at a mass ratio of 1:1, then heat and stir at 80°C for 4 hours to completely disperse the resin to obtain a dispersion;

[0033] S2: Add cycloal...

Embodiment 3

[0038] This embodiment provides a flexible bonding conductive adhesive. The raw material components are calculated in parts by weight, including: 10 parts of flexible amorphous polyester resin, 3.0 parts of alicyclic epoxy resin, 1.5 parts of pressure-sensitive acrylic resin, based on 0.25 parts of hexamethylene diisocyanate blocking curing agent, 0.4 parts of hexafluoroantimonate, 1.2 parts of epoxy silane coupling agent, 15 parts of diethylene glycol butyl ether acetate, and a large particle size of 6-12 μm 72 parts of silver powder, 8 parts of silver powder with a particle size of 0.5-3 μm in small flake diameter.

[0039] According to above-mentioned raw material, adopt the preparation method of flexible bonding conductive glue provided by the present invention, prepare flexible bonding conductive glue:

[0040] S1: Mix flexible polyester resin and diethylene glycol butyl ether acetate at a mass ratio of 1:1, then heat and stir at 80°C for 6 hours to completely disperse th...

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Abstract

The invention relates to a flexible bonding electroconductive adhesive and a preparation method thereof. The flexible bonding electroconductive adhesive comprises the raw material components in partsby weight: 9 to 10 parts of flexible polyester resin, 2.5 to 3.0 parts of epoxy resin, 1.3 to 1.5 of acrylic resin, 0.15 to 0.25 part of a seal curing agent, 0.2 to 0.4 part of a latent cationic curing agent, 0.8 to 1.2 parts of a silane coupling agent, 14 to 15 parts of an organic solvent and 60 to 80 parts of a silver powder. The flexible bonding electroconductive adhesive provided by the invention can improve the bonding property of the electroconductive adhesive, can make the electroconductive adhesive placed stably at room temperature, and can undergo a reaction to be cured when being baked at the temperature of 130 DEG C during heating. The flexible bonding electroconductive adhesive can be widely applied in novel consumer electronic products including splicing of flexible touch display screens and large-scale flexible screens, curved screen sealing, thin film batteries and the like.

Description

technical field [0001] The invention relates to the technical field of conductive adhesive, in particular to a flexible adhesive conductive adhesive and a preparation method thereof. Background technique [0002] In the traditional microelectronics industry, the eutectic soldering process is used to solder electronic components to the substrate. However, the solder used in eutectic soldering contains lead, which does not meet environmental protection requirements, and welding requires high temperature to melt the alloy, which requires Use expensive thermally stable substrates. As a substitute for traditional Sn / Pb solder, conductive adhesive has a low curing temperature, is suitable for high-density, narrow-pitch connections, and has good environmental performance. It can be bonded to substrates of different materials. The bonding equipment is simple and low in cost, etc. advantages, it has been widely used. [0003] Generally speaking, conductive adhesive is composed of r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06C09J11/04C09J11/06C09J9/02C08G18/42C08G18/58C08G18/73
CPCC08G18/4045C08G18/42C08G18/58C08G18/73C08K2201/003C08K2201/014C09J9/02C09J11/04C09J11/06C09J175/06C08L33/00C08K13/04C08K7/00C08K3/24C08K5/5435
Inventor 李辰羚
Owner SHENZHEN SILMAC NEW MATERIAL
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