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Adhesive film back plate integrated material and preparation process thereof

A preparation process and backplane technology, applied in the field of adhesive film backplane integrated materials and their preparation process, can solve problems such as affecting the quality of the adhesive film, affecting the mechanical properties of the material, losing physical properties, etc., to improve the light transmittance, use Long service life and improved barrier properties

Inactive Publication Date: 2018-05-15
MING CROWN ADVANCED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Once the sealing additive is consumed, the hydrolysis rate will rise rapidly, causing the molecular chain of PET to break and lose its physical properties, and gradually pulverize, which will affect the mechanical properties of the material to a large extent, and then directly affect the quality of the film.

Method used

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  • Adhesive film back plate integrated material and preparation process thereof
  • Adhesive film back plate integrated material and preparation process thereof
  • Adhesive film back plate integrated material and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] See figure 1 , an adhesive film backboard integrated material, including an adhesive film layer 1, a structural reinforcement layer 2, an adhesive layer 3 and a weather-resistant layer 4 sequentially connected from the inside to the outside, the adhesive film layer 1 and the structural reinforcement layer There is a frosted layer 5 between the two, and the adhesive film layer 1 is made of modified POE thermoplastic elastomer.

[0057] The thickness of the adhesive film layer is 300 μm, the thickness of the frosted layer is 5 μm, the thickness of the structural reinforcement layer is 400 μm, the thickness of the adhesive layer is 1 μm, and the thickness of the weather-resistant layer is 5 μm.

[0058] The modified POE thermoplastic elastomer includes the following raw materials in parts by weight:

[0059]

[0060] The weight content of the octene monomer in the POE resin is 25%, the melt flow rate of the POE resin is 10g / 10min, and the light transmittance is greater...

Embodiment 2

[0074] The difference between this embodiment and above-mentioned embodiment 1 is:

[0075] The thickness of the adhesive film layer is 400 μm, the thickness of the frosted layer is 8 μm, the thickness of the structural reinforcement layer is 315 μm, the thickness of the adhesive layer is 7 μm, and the thickness of the weather-resistant layer is 15 μm.

[0076] The modified POE thermoplastic elastomer includes the following raw materials in parts by weight:

[0077]

[0078]

[0079] The weight content of the octene monomer in the POE resin is 27%, the melt flow rate of the POE resin is 17g / 10min, and the light transmittance is greater than 83%.

[0080] The POE grafted modified resin is a mixture made of POE, maleic anhydride and dicumyl peroxide in a weight ratio of 95:1.3:0.12, which is blended and extruded at a temperature of 183°C. .

[0081] The crosslinking agent is peroxy-2-ethylhexyl tert-butyl carbonate; the crosslinking assistant is trimethylolpropane triacr...

Embodiment 3

[0088] The difference between this embodiment and above-mentioned embodiment 1 is:

[0089] The thickness of the adhesive film layer is 500 μm, the thickness of the frosted layer is 10 μm, the thickness of the structural reinforcement layer is 225 μm, the thickness of the adhesive layer is 13 μm, and the thickness of the weather-resistant layer is 27.5 μm.

[0090] The modified POE thermoplastic elastomer includes the following raw materials in parts by weight:

[0091]

[0092] The weight content of the octene monomer in the POE resin is 29%, the melt flow rate of the POE resin is 25g / 10min, and the light transmittance is greater than 86%.

[0093] The POE grafted modified resin is a mixture made of POE, maleic anhydride and dicumyl peroxide in a weight ratio of 100:1.5:0.1, and prepared by blending, extrusion and granulation at a temperature of 185°C .

[0094] The cross-linking agent is 3,3-di(tert-butyl peroxy) ethyl butyrate; the cross-linking assistant is triallyl i...

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Abstract

The invention relates to the technical field of adhesive film back plates, in particular to an adhesive film back plate integrated material and a preparation process thereof. The adhesive film back plate integrated material comprises an adhesive film layer, a structure reinforcement layer, a bonding layer and a weather-proof layer which are sequentially connected from inside to outside, a frostedlayer is arranged between the adhesive film layer and the structure reinforcement layer, and the adhesive film layer is prepared from modified thermoplastic POE (polyolefin elastomer). The adhesive film back plate integrated material has performances such as better barrier property, heat resistance, aging resistance, toughness, light transmittance and electrical insulating property, and is strongin layer-to-layer bonding power, not easy to fall off and long in service life. The preparation process is convenient to operate and control, high in production efficiency and low in production cost,the POE adhesive film layer and the frosted layer can be firmly adhered and smoothly curled, the thicknesses of the POE adhesive film layer and the frosted layer can be controlled, the prepared adhesive film back plate integrated material is excellent in performance, the assembly procedure of a component is simplified, and the assembly cost of the component is reduced.

Description

technical field [0001] The invention relates to the technical field of adhesive film backboards, in particular to an adhesive film backboard integrated material and a preparation process thereof. Background technique [0002] With the rapid development of economy and society, environmental pollution is becoming more and more serious, and using solar energy as a new energy to replace traditional petrochemical energy is one of the important ways to solve the problems of environmental pollution and energy depletion. At present, the utilization of solar energy is mainly through converting it into electrical energy through solar cell components, and then performing other purposes. The solar cell module includes structural components such as crystalline silicon cells, encapsulation film, backplane and glass, among which the encapsulation material plays a pivotal role in the module. It is the key material for bonding the cell, backplane and glass. It is required to have good adhes...

Claims

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Application Information

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IPC IPC(8): C09J7/29C09J123/08C09J151/06C09J11/06H01L31/048H01L31/049
CPCC08L2201/08C08L2201/14C08L2203/204C08L2207/04C09J11/06C09J123/0815C09J2203/322C09J2301/16C09J2301/408C09J2423/04H01L31/0481H01L31/049C08L51/06C08K5/00C08K5/526C08K5/3435C08K5/3475Y02E10/50
Inventor 张伟祥张鹏徐海燕方艳吴松纪孝熹
Owner MING CROWN ADVANCED MATERIAL CO LTD
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