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Light guide plate packaging structure for microstructure array with surface having quantum dots and manufacturing method thereof

A technology of microstructure array and packaging structure, which is applied in the directions of plane/plate light guides, light guides of lighting systems, light guides, etc., can solve the problems of reducing the luminous performance of quantum dots, and solve the problems of preparation and integrated packaging, and the process flow is complete. , The effect of good water and oxygen barrier ability

Inactive Publication Date: 2018-05-11
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the object of the present invention is to provide a light guide plate packaging structure and manufacturing method for the surface containing quantum dot microstructure arrays, the packaging structure of the present invention solves the packaging problem of discretely distributed quantum dot microstructure arrays, Compared with other packaging forms, it has the advantages of complete functions, simplified structure, simple process and reduced cost. This packaging structure can improve the water and oxygen barrier ability of quantum dots without reducing the luminous performance of quantum dots. Its processing technology is easy to realize

Method used

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  • Light guide plate packaging structure for microstructure array with surface having quantum dots and manufacturing method thereof
  • Light guide plate packaging structure for microstructure array with surface having quantum dots and manufacturing method thereof
  • Light guide plate packaging structure for microstructure array with surface having quantum dots and manufacturing method thereof

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Embodiment 1

[0032] image 3 The encapsulation structure of the light guide plate with the quantum dot microstructure array on the surface is shown, which includes a light guide plate substrate layer 1 , a barrier layer 2 , a quantum dot microstructure array dimming layer 3 , and an encapsulation layer 4 . exist image 3 In the first initial structure shown in , the quantum dot microstructure array dimming layer 3 is composed of quantum dots 31 and composite materials 32 . The quantum dot microstructure array contains one or more quantum dots and composite scattering materials with a central wavelength between 380-780nm. It is made by mixing quantum dots and composite scattering materials in a certain proportion to form a quantum dot slurry. Its ratio can be determined according to needs. The quantum dot microstructure array is formed by inkjet printing method. The thickness of the quantum dot microstructure array is 20-50 μm. The shape of the quantum dot microstructure array can be hemis...

Embodiment 2

[0037] Figure 5 The encapsulation structure of the light guide plate with the quantum dot microstructure array on the surface is shown, which includes a light guide plate substrate layer 1 , a barrier layer 2 , a quantum dot microstructure array dimming layer 3 , and an encapsulation layer 4 . The quantum dot microstructure array dimming layer 3 is composed of quantum dots 31 and composite materials 32. The preparation and formation of the quantum dot microstructure array is similar to that in Embodiment 1 of the present invention, and will not be repeated here. Outside the dimming layer of the quantum dot microstructure array is the encapsulation layer, which can be coated by spin coating or pulling method, but not limited to these methods. The material of the encapsulation layer is specifically made of inorganic materials such as silicon dioxide, silicon oxynitride, oxide Composed of aluminum, its thickness is 15-25 μm. Figure 5 Middle 5 is a mask plate, which is placed u...

Embodiment 3

[0043] Figure 7 The encapsulation structure of the light guide plate with the quantum dot microstructure array on the surface is shown, which includes a light guide plate substrate layer 1 , a barrier layer 2 , a quantum dot microstructure array dimming layer 3 , and an encapsulation layer 4 . exist image 3 The initial structure shown in the figure modifies the formation position of the quantum dot network. The quantum dot microstructure array can be embedded in the concave groove on the lower surface of the light guide plate. The groove can be formed by laser etching or hot pressing, and the quantum dot The dot paste is printed in the groove by screen printing, transfer printing or inkjet printing, and after the quantum dot microstructure array is cured, a packaging layer is printed by point-to-point screen printing or inkjet printing overprinting, or After the quantum dots are solidified, directly spin coat or pull a layer of encapsulation layer, Figure 8 is a schematic...

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Abstract

The present invention provides a light guide plate packaging structure for a microstructure array with a surface having quantum dots and a manufacturing method thereof. The packaging structure is a laminated structure, and comprises a barrier layer, a quantum dot microstructure array light modulation layer and a packaging layer. The packaging structure can employ a full ink-jet printing technologyfor preparation, and the manufacturing method of the packaging structure concretely comprises the steps of: on a basis that a substrate performs preprocessing to form the barrier layer, and uniformlymixed quantum dot slurry is molded at the lower surface of the light guide plate through ink-jet printing and is subjected to solidification to form the light modulation layer; and a layer of transparent barrier materials is subjected to point-to-point ink-jet printing on the light guide plate having quantum dot net points and is subjected to solidification to form the packaging layer. The packaging problem of the discretely distributed quantum dot microstructure arrays is solved, and compared to other packaging modes, the light guide plate packaging structure for the microstructure array with surface having quantum dots and the manufacturing method thereof are complete in function, simple in structure, simple in process and low in cost, and can be further popularized and applied to otherillumination fields.

Description

technical field [0001] The invention relates to a packaging structure of a light guide plate with a quantum dot microstructure array on its surface and a manufacturing method thereof, belonging to the technical field of quantum dot deviceization. technical background [0002] In recent years, quantum dot semiconductor materials and their products have set off an upsurge in scientific research and application development. Quantum dots, also known as semiconductor nanocrystals, generally have a size between 1-10nm, and have spectral characteristics such as wide excitation spectrum, symmetrical distribution and narrow width of emission spectrum, adjustable color, and high photochemical stability. White light can be generated by using a blue light-emitting diode to excite a mixture of red and green quantum dots. Quantum dots are widely used in electroluminescent devices, photoluminescent devices, displays, solid-state lighting, biomedicine and other fields. Due to the strong si...

Claims

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Application Information

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IPC IPC(8): G02B6/00
CPCG02B6/0065G02B6/0033G02B6/004
Inventor 陈恩果徐胜叶芸郭太良林金堂林志贤谢洪兴
Owner FUZHOU UNIV
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