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Three-dimensional network porous heat-conducting heat radiation device and preparation method thereof

A three-dimensional network and heat dissipation device technology, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of heat pipes with small heat dissipation area, large weight, and thick thickness

Pending Publication Date: 2018-04-20
WUZHOU HGP ADVANCED MATERIALS TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this traditional heat pipe has the disadvantages of small heat dissipation area, large weight, and thick thickness, and it is difficult to meet the requirements of light and thin integrated circuits in the future.

Method used

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  • Three-dimensional network porous heat-conducting heat radiation device and preparation method thereof
  • Three-dimensional network porous heat-conducting heat radiation device and preparation method thereof
  • Three-dimensional network porous heat-conducting heat radiation device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The copper foam with a thickness of 5mm and an average hole diameter of 1mm is used as the substrate, and the average cross-sectional area of ​​the internal channels of the wire mesh constituting the foam metal is 1mm. 2 .

[0036] The thickness of the high thermal conductivity and high heat radiation material is 3 μm, and its composition is: main resin accounts for 40%, thermal conductive filler 8%, thermal radiation filler 12%, auxiliary agent 8%, diluent 32%, of which the main resin is epoxy resin, thermally conductive The filler is boron nitride, and the thermal radiation filler is mica. The average particle size of boron nitride is 1 μm, and its thermal conductivity is 125 W / m K. The average particle size of the thermal radiation filler is 0.5 μm, and its thermal radiation coefficient It is 0.91; additives include dispersant, coupling agent, defoamer, leveling agent, diluent is toluene. First add the thermally conductive filler and the thermal radiation filler int...

Embodiment 2

[0040] The foamed aluminum with a thickness of 10mm and an average pore diameter of 8mm is used as the substrate, and the surface of the foamed aluminum is covered with a copper deposition layer. 2 .

[0041] The average thickness of the material with high thermal conductivity and high heat radiation is 10 μm, and its composition is: 40% of the main resin, 10% of thermally conductive filler, 15% of thermal radiation filler, 6% of auxiliary agent, and 29% of diluent. The main resin is polyurethane, and the thermally conductive filler is Silicon nitride with an average particle size of 5 μm, expanded graphite with an average particle size of 30 μm, zirconia with an average particle size of 10 μm, silicon dioxide with an average particle size of 0.5 μm, and graphite with an average particle size of 1 μm alumina. Auxiliaries include dispersant, coupling agent, defoamer, leveling agent, diluent is ethyl acetate. First add the thermally conductive filler and the heat radiation fil...

Embodiment 3

[0045] With a foamed copper-nickel alloy with a thickness of 45mm and an average pore diameter of 10mm as the substrate, the average cross-sectional area of ​​the internal pores of the wire mesh constituting the foam metal is 6mm 2 .

[0046] The average thickness of the high thermal conductivity and high heat radiation material is 100 μm, and its composition is: main resin accounts for 35%, thermal conductive filler 10%, thermal radiation filler 10%, auxiliary agent 12%, diluent 33%, of which the main resin is acrylic resin, thermal conductive filler It is aluminum nitride with an average particle size of 0.5 μm, graphene with an average particle size of 0.01 μm, and the heat radiation filler is manganese dioxide with an average particle size of 10 μm, iron oxide, copper oxide and cobalt oxide with an average particle size of 5 μm . Auxiliaries include dispersant, coupling agent, defoamer, leveling agent, diluent is water. First add the thermally conductive filler and heat ...

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Abstract

The invention relates to a three-dimensional network porous heat-conducting heat radiation device and a preparation method thereof. The three-dimensional network porous heat-conducting heat radiationdevice comprises foam metal, high-heat-conduction high-heat-radiation material and a phase-changing heat transferring material, wherein the heat transferring performance is improved by virtue of the phase-changing heat transferring material filling pores inside a foam metal skeleton wire net, the heat radiation performance is improved by virtue of the high-heat-conduction high-heat-radiation material smeared on the surface of the foam metal skeleton, and the three-dimensional network porous heat-conducting heat radiation device is suitable for the electron industry and solves the heat radiation problem of heating elements and devices.

Description

technical field [0001] The invention relates to the field of heat dissipation materials for electronic components, in particular to a three-dimensional network porous heat conduction heat dissipation device and a preparation method thereof. Background technique [0002] In recent years, electronic heat dissipation technology has gradually attracted attention, mainly because it has a considerable relationship with the rapid development of electronic products. The constantly updated personal computers, notebook computers, smart phones, flexible display screens, digital projectors, etc. have entered the era of portable and miniaturization. In addition to expecting high-efficiency processing speed, people also hope that the product has a thinner appearance and higher computing speed to meet the requirements of high-speed, portable, and mobile work. Therefore, electronic devices are constantly developing in the direction of high frequency, high speed, and the density and miniatur...

Claims

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Application Information

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IPC IPC(8): C09D163/00C09D175/04C09D133/00C09D7/61H01L23/373
CPCH01L23/373H01L23/3736H01L23/3737C09D133/00C09D163/00C09D175/04C08K3/00C08K3/34C08K3/04C08K3/36C08K7/24C08K2003/2248C08K2003/2265C08K2003/2262C08K2003/2227C08K2003/2244C08K2003/2289C08K2003/285C08K2003/385C08K2201/003
Inventor 穆俊江韦雁途吴天和
Owner WUZHOU HGP ADVANCED MATERIALS TECH CORP
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