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Manufacturing method of metal lines distributed on different orientation surfaces of insulator

A technology of metal circuit and manufacturing method, which is applied in the direction of printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, printed circuit, etc., to achieve the effect of small change in surface roughness of the bracket, low surface roughness, and high connection reliability

Active Publication Date: 2018-03-27
SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims at the various problems of manufacturing metal lines in the current above-mentioned LDS and MIPTEC manufacturing technologies, and proposes a method for manufacturing metal lines distributed on the surface of the insulator in different orientations

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  • Manufacturing method of metal lines distributed on different orientation surfaces of insulator
  • Manufacturing method of metal lines distributed on different orientation surfaces of insulator
  • Manufacturing method of metal lines distributed on different orientation surfaces of insulator

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Embodiment 1

[0062] On the basis of the above non-limiting embodiments, this embodiment provides a method for manufacturing a metal circuit on a small insulator, and the specific manufacturing method is as follows:

[0063] A1. making the insulator support 1 of the metal circuit;

[0064] A2. Copper is sputtered on the surface of the insulator support 1 and the frame 3 as a bottom metal;

[0065] A3. Electroplate copper on the underlying metal, thicken until the thickness of the copper plating is equal to or slightly greater than the line requirements;

[0066] A4. Electroplate a tin-lead alloy on the surface of the copper plating layer as a resist layer for subsequent chemical etching of copper;

[0067] A5. Use a laser to ablate the tin-lead alloy along the outer contour of each metal line until the copper coating under the tin-lead alloy coating is exposed. The ablation depth is greater than the tin-lead alloy layer but less than the copper coating. The width of the ablation groove is ...

Embodiment 2

[0076] On the basis of the above-mentioned non-limiting embodiments, this embodiment further provides a method for manufacturing metal lines distributed on the surface of the insulator in different orientations, the method specifically includes:

[0077] B1. Carrier insulator support for making metal lines;

[0078] B2. Sputter copper plating on the surface of the insulator bracket and frame as the underlying metal;

[0079] B3. ablate the underlying metal along the outer contour of the metal circuit 13.1 and the electroplating lead 13.2 with a laser, and divide the underlying metal on the insulator support into a circuit area 13 and a non-circuit area 14 that include the metal circuit and its electroplating lead and are electrically insulated from each other, Such as Figure 9 shown;

[0080] B4. electroplating copper and tin-lead on the line area 13, the thickness of the copper coating needs to reach the required thickness of the line, and the metal on the insulator suppor...

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Abstract

The invention relates to the technical field of precision metal line manufacturing method, and specifically relates to a manufacturing method of metal lines distributed on different orientation surfaces of an insulator. The manufacturing method of metal lines distributed on different orientation surfaces of an insulator includes the steps: 1) manufacturing an insulator support of metal lines; 2) plating the surface of the insulator support with one bottom layer of metal; and 3) by means of the chemical and physical treatment technologies, such as laser ablation, electroplating, chemical etching of copper, chemical etching of tin lead alloy, and chemical nickel, palladium and gold plating, manufacturing metal lines on the insulator support by taking copper, chemical nickel, palladium and gold as leads and taking the bottom layer of metal as the basis. The metal lines formed by means of the manufacturing method of metal lines distributed on different orientation surfaces of an insulatorare suitable for application with wire bonding connection and SMT welding.

Description

technical field [0001] The invention relates to the technical field of precision metal circuit manufacturing methods, in particular to a method for manufacturing metal circuits distributed on the surface of an insulator with different orientations. Background technique [0002] As electronic products gradually tend to be miniaturized, in the field of circuit miniaturization manufacturing, it is necessary to arrange metal circuits, IC chips and electronic components with 25um / 25um line width and line spacing on different surfaces of insulators. It adopts MID manufacturing technology, which is suitable for manufacturing precision metal circuits on the surface of insulator brackets. Currently, representative MID manufacturing technologies include LDS, MIPTEC and so on. [0003] The LDS manufacturing method is to use laser ablation to ablate the surface of the line area of ​​the insulator bracket, so that the surface material of the line area produces an electroless plating cata...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/06
CPCH05K3/027H05K3/06H05K2203/0502H05K2203/107
Inventor 满方明
Owner SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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