A kind of photosensitive polyimide and preparation method thereof

A photosensitive polyimide and polyimide technology, applied in the field of photosensitive polyimide and its preparation, can solve the problems of poor resolution, increased solubility difference of polyamic acid, large acting force, etc. High, good photosensitivity, good film-forming effect

Active Publication Date: 2020-11-17
杭州超通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is still a mixture of photosensitive polyimide, but the intermolecular force between the organic group in the o-diazonaphthoquinone sulfonate and the polyamic acid is relatively large, which makes the polyamic acid dissolve in the exposed area and the non-exposed area The difference in gender increases, and the resolution has also been improved to a certain extent, but it has not fundamentally solved the problem of poor resolution

Method used

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  • A kind of photosensitive polyimide and preparation method thereof
  • A kind of photosensitive polyimide and preparation method thereof
  • A kind of photosensitive polyimide and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] a. Dissolve α, ω-bis(methylamino)polydimethylsiloxane (0.02mol) halogenated diaminophenoxyphenyl hexafluoropropane (0.045mol) in ethanol, add triethylamine After reacting for 5 hours, the substituted product was separated by distillation under reduced pressure;

[0033] b. Dissolve the above-mentioned substituted product in N, N'-dimethylformamide, the solute mass percentage concentration is 15%, after completely dissolving, cool to room temperature, add dianhydride (0.045mol), nitrogen protection, at 10°C Next, stir and react for 3 hours to obtain a polyamic acid solution;

[0034] c. Add p-hydroxyaniline (0.00025mol), and react at room temperature for 2 hours to obtain a polyamic acid solution terminated with phenolic hydroxyl groups;

[0035] d. adding acetic anhydride and pyridine for dehydration imidization reaction, reacting at 50°C for 7 hours, after the reaction is completed, settling, filtering, washing, and vacuum drying to obtain polyimide powder terminated ...

Embodiment 2

[0040] a. Dissolve α, ω-bis(methylamino)polydimethylsiloxane (0.03mol) halogenated diaminophenoxyphenyl hexafluoropropane (0.07mol) in ethanol, add triethylamine After reacting for 6 hours, the substituted product was separated by distillation under reduced pressure;

[0041]b. Dissolve the above substituted product in N,N'-dimethylformamide, the solute mass percentage concentration is 20%, after completely dissolving, cool to room temperature, add dianhydride (0.075mol), nitrogen protection, at 15°C Next, stir and react for 4 hours to obtain a polyamic acid solution;

[0042] c. add m-hydroxyaniline (0.00035mol), and react at room temperature for 3 hours to obtain a polyamic acid solution terminated with phenolic hydroxyl groups;

[0043] d. Add acetic anhydride and pyridine to carry out dehydration imidization reaction, react at 60°C for 8 hours, after the reaction is completed, precipitate, filter, wash, and dry in vacuum to obtain polyimide powder terminated with phenolic...

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Abstract

The invention discloses photosensitive polyimide. The photosensitive polyimide is characterized in that a flexible siloxane chain, an aminophenoxy phenyl hexafluoropropane group and a diazo naphthoquinone are introduced to a polyimide main chain. The novel photosensitive polyimide has thermoplastic processing performance, and is high in photosensitive property, resolution ratio, adhesive force, filming performance, and heat resistance.

Description

technical field [0001] The invention relates to a photosensitive polyimide and a preparation method thereof, in particular to a photosensitive polyimide containing a flexible siloxane chain, an aminophenoxyphenylhexafluoropropane group and a diazonaphthoquinone structure and its preparation method. Background technique [0002] Polyimide (PI) refers to a class of polymers containing imide rings on the main chain. As a cutting-edge material with outstanding performance, it is known for its excellent electrical insulation, wear resistance, high temperature radiation resistance and physical Mechanical properties have been widely used. It can not only be applied to the matrix resin of carbon fiber reinforced advanced composite materials in aerospace, self-lubricating engineering plastics resistant to high and low temperature, high-performance fiber materials, motor transformers and high-performance electrical insulation materials, matrix resin of glass fiber reinforced printed ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08G77/455
CPCC08G73/106C08G73/1064C08G77/455
Inventor 黄健魏桂荣
Owner 杭州超通科技有限公司
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