Alkaline etching solution and preparation method thereof
An etching solution and alkaline technology, applied to the alkaline etching solution of metal copper on printed circuit boards, alkaline etching solution and its preparation field, can solve the problems of unstable etching rate, poor etching uniformity, etc., and achieve fast etching speed , Low cost of use, safe and environmentally friendly operation
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Embodiment 1
[0034] 100mL alkaline etching solution and its preparation method:
[0036] Ammonium bicarbonate: 5g
[0037] Ammonia: 25% concentration, 48g
[0038] Additive: 0.4g
[0039] The balance is water.
[0040] Add ammonium chloride, ammonium bicarbonate, ammonia water, additives (urea, including urea, thiourea, dithiourea, etc.) into a beaker, add water to 100mL, stir evenly, and obtain an alkaline etching solution.
[0041] The parameter of gained etching solution is as follows:
[0042] Density, (20°C): 1.020-1.040
[0043] pH value: 9.5±0.5
[0044] Alkalinity, mol / L: 4.0-7.0
[0045] Chloride ion content, mol / L: 4.6-5.5
[0046] Chromaticity, degree: ≤20
[0047] Transparency: ≥140.
Embodiment 2
[0049] 1000L alkaline etching solution and its preparation method:
[0050] Ammonium chloride: 200-500Kg
[0051] Ammonium bicarbonate: 25-50Kg
[0052] Ammonia water: the concentration is 25%, 15-500Kg
[0053] Additives: less than 10Kg
[0054] The balance is water.
[0055] Add ammonium chloride, ammonium bicarbonate, ammonia water, additives (urea, including urea, thiourea, dithiourea, etc.) into a beaker, add water to 1000L, stir evenly, and obtain an alkaline etching solution.
[0056] The parameter of gained etching solution is as follows:
[0057] Density (20°C): 1.020-1.040
[0058] pH value: 9.5±0.5
[0059] Alkalinity: 4.0-7.0mol / L
[0060] Chloride ion content: 4.6-5.5mol / L
[0061] Chroma: ≤20
[0062] Transparency: ≥140.
[0063] This product belongs to low ammonia, high copper≧135g / L, fast copper etching speed (2-3ml / min), low side erosion, suitable for high-precision inner and outer layer etching, dense fine circuit board etching.
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