Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of titanium ruthenium co-doped vanadium dioxide thermosensitive thin film material and preparation method thereof

A vanadium dioxide heat-sensitive, vanadium oxide thin film technology, applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problem of limiting the selection of device working parameters, restricting the design of pixel structure, and reducing the signal-to-noise ratio To achieve the effect of flexible pixel structure design and device working parameter selection, avoiding adverse effects, and improving sensitivity

Active Publication Date: 2019-07-16
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the monoclinic VO 2 Thin films also face three problems when used as heat-sensitive materials for uncooled focal plane arrays: first, the monoclinic phase structure of VO 2 The thermal hysteresis migration phenomenon during the phase transition of thin films means high thermal hysteresis noise, which will significantly increase the noise of the device and reduce its signal-to-noise ratio
Multiple volume changes will inevitably reduce the reliability of the uncooled focal plane array element bridge film layer
Third, VO 2 The film has a high room temperature resistivity (>10Ω cm), which not only restricts the design of the pixel structure, but also limits the selection of working parameters of the device
Therefore, VO with a monoclinic phase structure 2 Thin films are difficult to obtain real applications in the development of high-performance uncooled infrared focal plane array devices as heat-sensitive films

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of titanium ruthenium co-doped vanadium dioxide thermosensitive thin film material and preparation method thereof
  • A kind of titanium ruthenium co-doped vanadium dioxide thermosensitive thin film material and preparation method thereof
  • A kind of titanium ruthenium co-doped vanadium dioxide thermosensitive thin film material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 11

[0046] Embodiment 1.1 (comparative example):

[0047] Will come with 250nmSiN X The thin film Si wafer was preheated at 100°C for 40 minutes in the vacuum environment of the sputtering chamber; then the pure vanadium target (99.9%) was used as the sputtering source, and the pure vanadium The target was pre-sputtered for 5 minutes; then, using an atmosphere with an oxygen / argon flow ratio of 1:20, and at a working pressure of 1.5Pa, the preheated substrate (with 250nm SiN X The vanadium oxide thin film was sputter-deposited on the thin film Si sheet) for 50 minutes; and then under the oxygen-enriched atmosphere with an oxygen / argon flow ratio of 10:1, and at a vacuum chamber pressure of 1.5 Pa, the enrichment was carried out at 380°C for 60 minutes. Oxygen atmosphere annealing. After the annealing is completed, the temperature is lowered to below 85° C., and the sample is taken out to obtain an undoped vanadium dioxide film (referred to as VO-11). This sample is used as a com...

Embodiment 12

[0054] Will come with 250nmSiN X The thin-film Si sheet was preheated at 120°C for 60 minutes in the vacuum environment of the sputtering chamber; then, the titanium-ruthenium-vanadium alloy target containing 6.0% titanium and 1.0% ruthenium (atomic percentage) was used in a pure argon atmosphere at 0.5Pa Under the working pressure, the titanium ruthenium vanadium alloy target was pre-sputtered for 15 minutes; then, the oxygen / argon flow ratio was 1:30, and the titanium ruthenium vanadium alloy target was sputtered under the working pressure of 2.5Pa. After the substrate (with 250nmSiN X Ti-Ru co-doped vanadium oxide thin film was deposited on the thin film Si sheet) for 50 minutes; and then under the oxygen-enriched atmosphere with the oxygen / argon flow ratio of 1:0, under the vacuum chamber pressure of 1.0Pa, carry out 350 ℃, 90 minutes Annealed in an oxygen-enriched atmosphere. After the annealing is completed, the temperature is lowered to below 85° C., and the sample is...

Embodiment 13

[0061] will come with 250nmSiO 2 The thin-film Si sheet was preheated at 100°C for 100 minutes in the vacuum environment of the sputtering chamber; then, a titanium-ruthenium-vanadium alloy target containing 7.5% titanium and 2.0% ruthenium (atomic percentage) was used in a pure argon atmosphere at 1.0Pa Under the working pressure, the titanium ruthenium vanadium alloy target was pre-sputtered for 10 minutes; then, the oxygen / argon flow ratio was 1:25, and the titanium ruthenium vanadium alloy target was sputtered under the working pressure of 2.0Pa. Deposit titanium ruthenium co-doped vanadium oxide thin film on the substrate after 50 minutes; then carry out 350 ℃, 90 minutes oxygen-enrichment atmosphere under the oxygen-enrichment atmosphere of 2:1 oxygen / argon flow ratio, under the vacuum chamber pressure of 3.0Pa Atmosphere annealing. After the annealing is completed, the temperature is lowered to below 85° C., and the sample is taken out to obtain a titanium-ruthenium co...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
purityaaaaaaaaaa
electrical resistivityaaaaaaaaaa
electrical resistivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a titanium-ruthenium co-doped vanadium dioxide heat-sensitive thin film material and a preparation method thereof, which can be used in the technical fields of uncooled infrared detectors and electronic thin films. Among them, the vanadium dioxide heat-sensitive film material is prepared with titanium and ruthenium as dopants, including a substrate layer and a titanium-ruthenium co-doped vanadium dioxide film layer; in the titanium-ruthenium co-doped vanadium dioxide film layer, titanium, ruthenium and vanadium The atomic percentages are 4.0‑7.0%, 0.5‑1.5%, 25.0‑30.0%, respectively, and the rest is oxygen. The invention also provides a method for preparing a vanadium dioxide heat-sensitive thin film material by using a reactive sputtering method using a titanium ruthenium vanadium alloy target as a source material, or using a co-reactive sputtering method using a titanium target, a ruthenium target and a vanadium target as sputtering sources. The vanadium dioxide thin film prepared by the present invention has a monoclinic polycrystalline structure, exhibits no phase transition characteristics, has a lower room temperature resistivity, and has a higher resistance than undoped vanadium dioxide and commonly used VO X The heat-sensitive thin film has a higher temperature coefficient of resistance; its preparation process is easy to realize through existing sputtering equipment or appropriate improvement of existing equipment, and is compatible with the device MEMS process.

Description

technical field [0001] The invention relates to the technical field of infrared detectors and electronic thin films, in particular to a vanadium dioxide heat-sensitive thin film material and a preparation method thereof, in particular to a vanadium dioxide heat-sensitive material with no phase change, low resistivity, and high temperature coefficient of resistance. Thin film materials and methods for their preparation. Background technique [0002] Uncooled infrared focal plane array detectors are widely used in fields such as forest fire prevention, security protection, power inspection, and medical treatment because they do not require a refrigerator, have the advantages of small size, light weight, and high sensitivity. In order to increase the detection distance of the device and reduce the manufacturing cost, the pixel of the uncooled red-infrared focal plane array tends to be gradually reduced, and has been gradually reduced from the initial 45um to the current 12um (R...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34C23C14/08
CPCC23C14/0036C23C14/083C23C14/34C23C14/3464C03C2218/322C03C17/245C03C2217/218C03C2217/24C03C2218/154C03C2218/31C03C2218/32
Inventor 顾德恩徐世洋周鑫郑宏航蒋亚东
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com