A kind of low-temperature curable powder coating and its preparation method and application
A powder coating and curing technology, applied in powder coatings, epoxy resin coatings, coatings, etc., can solve the problems of poor storage at room temperature, and achieve the effects of good mechanical properties, good leveling, and high compatibility
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Embodiment 1
[0050] The preparation of embodiment 1 low temperature curing agent
[0051] Weigh bisphenol F and 2-methylimidazole with an epoxy equivalent of 170 according to the molar ratio of epoxy group: secondary amino group = 1.1: 1, and dissolve 40g of 2-methylimidazole in 120g of xylene solution, at 120°C Stir to dissolve, slowly drop 92g of bisphenol F resin, and gradually produce a reddish-brown precipitate; after the reaction is complete, filter out the xylene solvent, and vacuumize the reddish-brown product at 140°C to remove residual xylene; after that, The reddish-brown product was dried for 1 hour in a 180°C blast oven, cooled to room temperature to obtain a dark reddish-brown solid; the dark reddish-brown solid was mixed with polyethylene wax (melting point: 110°C) in a mass ratio of 3:1, Stir evenly at 120°C, cool to room temperature and break to obtain a wax-coated low-temperature curing agent.
Embodiment 2
[0052] The preparation of embodiment 2 low temperature curing agent
[0053] Weigh toluene diisocyanate and 2-methylimidazole by molar ratio of isocyanate group: secondary amino group = 0.95:1, dissolve 30g of 2-methylimidazole in 100g of chloroform solution, stir and dissolve at 70°C, and dissolve 61g of toluene diisocyanate The isocyanate was slowly added dropwise to the above solution. After the reaction, the chloroform was removed by vacuuming at 70° C. to finally obtain dimethylimidazole modified with toluene diisocyanate. Further, the modified imidazole and polyethylene wax (melting point: 110°C) can be mixed in a mass ratio of 3:1, stirred evenly at 120°C, cooled to room temperature and crushed to obtain a wax-coated low-temperature curing agent.
Embodiment 3
[0054] The preparation of embodiment 3 low temperature curing agent
[0055] Weigh bisphenol F and 2-methylimidazole with an epoxy equivalent of 170 according to the molar ratio of epoxy group: secondary amino group=1.2:1, dissolve 40g of 2-methylimidazole in 120g of xylene solution, at 110°C Stir to dissolve, slowly drop 100g of bisphenol F resin, and gradually produce a reddish-brown precipitate; after the reaction is complete, filter out the xylene solvent, and vacuumize the reddish-brown product at 120°C to remove residual xylene; after that, The reddish-brown product was dried in a blast drying oven at 150°C for 1 hour, and then cooled to room temperature to obtain an epoxy-modified dimethylimidazole curing agent.
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